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SFFS755 November 2023 SN74HCS14-Q1

2.1 BQA, D, DYY, and PW Packages

This section provides Functional Safety Failure In Time (FIT) rates for BQA, D, DYY, and PW packages of SN74HCS14-Q1 based on two different industry-wide used reliability standards:

Table 2-1 provides FIT rates based on IEC TR 62380 / ISO 26262 part 11
Table 2-2 provides FIT rates based on the Siemens Norm SN 29500-2

Table 2-1 Component Failure Rates per IEC TR 62380 / ISO 26262 Part 11

FIT IEC TR 62380 / ISO 26262	FIT (Failures Per 10⁹ Hours) - WQFN (BQA)	FIT (Failures Per 10⁹ Hours) - SOIC (D)	FIT (Failures Per 10⁹ Hours) - SOT (DYY)	FIT (Failures Per 10⁹ Hours) - TSSOP (PW)
Total Component FIT Rate	8	18	8	11
Die FIT Rate	3	3	4	3
Package FIT Rate	5	15	4	8

FIT IEC TR 62380 / ISO 26262

FIT

(Failures Per 10⁹ Hours)

- WQFN (BQA)

FIT

(Failures Per 10⁹ Hours)

- SOIC (D)

FIT

(Failures Per 10⁹ Hours)

- SOT (DYY)

FIT

(Failures Per 10⁹ Hours)

- TSSOP (PW)

Total Component FIT Rate

Die FIT Rate

Package FIT Rate

The failure rate and mission profile information in Table 2-1 comes from the Reliability data handbook IEC TR 62380 / ISO 26262 part 11:

Mission Profile: Motor Control from Table 11
Power dissipation: 100 mW
Climate type: World-wide Table 8
Package factor (lambda 3): Table 17b
Substrate Material: FR4
EOS FIT rate assumed: 0 FIT

Table 2-2 Component Failure Rates per Siemens Norm SN 29500-2

Table	Category	Reference FIT Rate	Reference Virtual T_J
3	CMOS Logic FCT, HC, LV, LVC, ALVC, VHC, and so forth	5 FIT	45°C

The Reference FIT Rate and Reference Virtual T_J (junction temperature) in Table 2-2 come from the Siemens Norm SN 29500-2 tables 1 through 5. Failure rates under operating conditions are calculated from the reference failure rate and virtual junction temperature using conversion information in SN 29500-2 section 4.