SFFS756 November 2023 SN74HCS20-Q1
This section provides Functional Safety Failure In Time (FIT) rates for D and PW packages of SN74HCS20-Q1 based on two different industry-wide used reliability standards:
FIT IEC TR 62380 / ISO 26262 |
FIT (Failures Per 109 Hours) - TSSOP (PW) |
FIT (Failures Per 109 Hours) - SOIC (D) |
---|---|---|
Total Component FIT Rate |
10 |
17 |
Die FIT Rate |
2 |
2 |
Package FIT Rate |
8 |
15 |
The failure rate and mission profile information in Table 2-1 comes from the Reliability data handbook IEC TR 62380 / ISO 26262 part 11:
Table | Category | Reference FIT Rate | Reference Virtual TJ |
---|---|---|---|
3 | CMOS Logic FCT, HC, LV, LVC, ALVC, VHC, and so forth | 5 FIT | 45°C |
The Reference FIT Rate and Reference Virtual TJ (junction temperature) in Table 2-2 come from the Siemens Norm SN 29500-2 tables 1 through 5. Failure rates under operating conditions are calculated from the reference failure rate and virtual junction temperature using conversion information in SN 29500-2 section 4.