SFFS757 February   2024 DLP4620S-Q1 , DLPC231S-Q1

 

  1.   1
  2. 1Introduction
    1.     Trademarks
  3. 2 DLP4620S-Q1 Chipset Functional Safety Capability
  4. 3Development Process for Management of Systematic Faults
    1. 3.1 TI New-Product Development Process
    2. 3.2 TI Functional Safety Development Process
  5. 4 DLP4620S-Q1 Chipset Overview
    1. 4.1 Targeted Applications
    2. 4.2 DLP4620S-Q1 Chipset Functional Safety Concept
      1. 4.2.1 Typical Hazards
      2. 4.2.2 Chipset Architecture
      3. 4.2.3 Built-In Self Tests
    3. 4.3 Functional Safety Constraints and Assumptions
  6. 5Description of Hardware Component Parts
    1. 5.1 Description of System Level Built In Self Test (BISTs)
  7. 6Management of Random Faults
    1. 6.1 Fault Reporting
      1. 6.1.1 HOST_IRQ
      2. 6.1.2 Error History
      3. 6.1.3 Fault Handling
    2. 6.2 Functional Safety Mechanism Categories
    3. 6.3 Description of Functional Safety Mechanisms
      1. 6.3.1 Video Path Protection
        1. 6.3.1.1 Video Input BISTs
        2. 6.3.1.2 Video Processing BISTs
        3. 6.3.1.3 Video Output BISTs
      2. 6.3.2 Illumination Control Protection
        1. 6.3.2.1 Communication Interface and Register Protection
        2. 6.3.2.2 LED Control Feedback Loop Protection
        3. 6.3.2.3 Data Load and Transfer Protection
        4. 6.3.2.4 Watchdogs and Clock Monitors
        5. 6.3.2.5 Voltage Monitors
  8.   A Summary of Recommended Functional Safety Mechanism Usage
  9.   B Distributed Developments
    1.     B.1 How the Functional Safety Lifecycle Applies to TI Functional Safety Products
    2.     B.2 Activities Performed by Texas Instruments
    3.     B.3 Information Provided
  10.   C Revision History

4.1 Targeted Applications

The DLP4620S-Q1 chipset is targeted at general-purpose functional safety applications. This is called Safety Element out of Context (SEooC) development according to ISO 26262-10. In this case, the development is done based on assumptions on the conditions of the semiconductor component usage, and then the assumptions are verified at the system level. This method is also used to meet the related requirements of IEC 61508 at the semiconductor level. This section describes some of the target applications for this component, the component safety concept, and then describes the assumptions about the systems (also know as Assumptions of Use or AoU) that were made in performing the safety analysis.

Example target applications include, but are not limited to, the following:

  • Automotive Head-Up Display
  • Automotive windshield cluster
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