SFFS799 March 2024 TLV365-Q1
1 Overview
This document contains information for TLVx365-Q1 (SOT-23 and SOIC packages) to aid in a functional safety system design. The SOT-23 package is the TLV365-Q1 and the SOIC package is the TLV2365-Q1. Information provided are:
- Functional Safety Failure In Time (FIT) rates of the semiconductor component estimated by the application of industry reliability standards
- Component failure modes and their distribution (FMD) based on the primary function of the device
- Pin failure mode analysis (Pin FMA)
TLVx365-Q1 shows the device functional block diagram for reference.
Figure 1-1 Functional Block DiagramTLVx365-Q1 was developed using a quality-managed development process, but was not developed in accordance with the IEC 61508 or ISO 26262 standards.