SFFSA10 October   2024 LMR51635

 

  1.   1
  2.   Trademarks
  3. 1Overview
  4. 2Functional Safety Failure In Time (FIT) Rates
    1. 2.1 LMR51625
    2. 2.2 LMR51635
  5. 3Failure Mode Distribution (FMD)
  6. 4Pin Failure Mode Analysis (Pin FMA)

Pin Failure Mode Analysis (Pin FMA)

This section provides a failure mode analysis (FMA) for the pins of the LMR51625 and LMR51635. The failure modes covered in this document include the typical pin-by-pin failure scenarios:

Table 4-2 through Table 4-5 also indicate how these pin conditions can affect the device as per the failure effects classification in Table 4-1.

Table 4-1 TI Classification of Failure Effects
ClassFailure Effects
APotential device damage that affects functionality.
BNo device damage, but loss of functionality.
CNo device damage, but performance degradation.
DNo device damage, no impact to functionality or performance.

Following are the assumptions of use and the device configuration assumed for the pin FMA in this section:

  • Device is used within the Recommended Operating Conditions and the Absolute Maximum Ratings found in the appropriate device data sheet.
  • Configuration is as shown in the Example Application Circuit found in the appropriate device data sheet.

Figure 4-1 shows the LMR51625 and LMR51635 pin diagram for the SOT-23 package. For a detailed description of the device pins please refer to the Pin Configuration and Functions section in the appropriate device data sheet.

LMR51625 LMR51635 Pin DiagramFigure 4-1 Pin Diagram
Table 4-2 Pin FMA for Device Pins Short-Circuited to Ground
Pin NamePin No.Description of Potential Failure EffectsFailure Effect Class
FB1The regulator operates at maximum duty cycle. Output voltage rises approximately to the input voltage (VIN) level. Damage to customer load and output stage components are possible. No effect on device.B
EN2Loss of ENABLE functionality. Device remains in shutdown mode.B
VIN3Device does not operate. No output voltage is generated. Output capacitors discharge through the input short. A large current reversal can damage the device.A
GND4Normal operation.D
SW5Damage to internal FET.A
CB6No output voltage.B
Table 4-3 Pin FMA for Device Pins Open-Circuited
Pin NamePin No.Description of Potential Failure EffectsFailure Effect Class
FB1VOUT is higher than the programmed output voltage.B
EN2Loss of ENABLE functionality. Erratic operation; loss of regulation is probable.B
VIN3No output voltage.B
GND4VOUT can be abnormal due to switching noise on analog circuits.B
SW5No output voltage.B
CB6No output voltage.B
Table 4-4 Pin FMA for Device Pins Short-Circuited to Adjacent Pin
Pin NamePin No.Shorted toDescription of Potential Failure EffectsFailure Effect Class
FB1ENIf EN exceeds 5.5V, damage occurs. No output voltage.A
EN2VINNo damage to device. Loss of ENABLE functionality.B
VIN3GNDDevice does not operate. No output voltage is generated. Output capacitors discharge through the input short. A large current reversal can damage the device.A
GND4SWDamage to internal FET.A
SW5CBNo output voltage. Damage to internal FET.B
CB6FBIf CB exceeds 5.5V, damage occurs. No output voltage.A
Table 4-5 Pin FMA for Device Pins Short-Circuited to VIN
Pin NamePin No.Description of Potential Failure EffectsFailure Effect Class
FB1If VIN exceeds 5.5V, damage occurs. No output voltage.A
EN2No damage to device. Loss of ENABLE functionality.B
VIN3No effect.D
GND4No output voltage. Damage to other pins referred to GND.A
SW5Damage to low-side MOSFET.A
CB6No output voltage. CB pin ESD clamp runs current to destruction.A