SFFSA14 October 2024 TPSI31P1-Q1

3 Failure Mode Distribution (FMD)

The failure mode distribution for the TPSI31P1-Q1 in Table 4-2 comes from the combination of common failure modes listed in standards such as IEC 61508 and ISO 26262, the ratio of sub-circuit function size and complexity and from best engineering judgment.

The failure modes listed in this section reflect random failure events and do not include failures resulting from misuse or overstress.

Table 3-1 Die Failure Modes and Distribution

Die Failure Modes	Failure Mode Distribution (%)
VDDH \| VDDM rails fail to power up. VDRV remains low.	25
VDRV does not respond to EN signaling.	15
Output power not meeting specification. Longer VDDH \| VDDM start-up and recovery times.	25
VDDH is not regulated, potential device damage.	15
VDRV propagation times are longer than specified.	5
Higher EMI.	5
Unpredictable power-down sequence.	5
VDRV output is held high.	5

The FMD in Table 4-2 excludes short-circuit faults across the isolation barrier. Faults for short circuits across the isolation barrier can be excluded according to ISO 61800-5-2:2016 if the following requirements are fulfilled:

The signal isolation component is OVC III according to IEC 61800-5-1. If a safety-separated extra low voltage (SELV) or protective extra low voltage (PELV) power supply is used, pollution degree 2 / OVC II applies. All requirements of IEC 61800-5-1:2007, 4.3.6 apply.
Measures are taken to ensure that an internal failure of the signal isolation component cannot result in excessive temperature of its insulating material.

Apply creepage and clearance requirements according to the specific equipment isolation standards of an application. Care must be taken to maintain the creepage and clearance distance of a board design to ensure that the mounting pads of the isolator on the printed-circuit board do not reduce this distance.