SLAU358Q September   2011  – October 2019

 

  1.   Read This First
    1.     If You Need Assistance
    2.     Trademarks
    3.     Related Documentation From Texas Instruments
    4.     FCC and CE Compliance
  2. 1Introduction
    1. 1.1 Software Installation
    2. 1.2 Driver Installation
    3. 1.3 Hardware Installation
  3. 2Operation
    1. 2.1 Programming MSP Flash Devices Using the MSP Gang Programmer
      1. 2.1.1  Programming Using Interactive Mode
        1. 2.1.1.1 GO
        2. 2.1.1.2 Erase
        3. 2.1.1.3 Blank Check
        4. 2.1.1.4 Program
        5. 2.1.1.5 Verify
        6. 2.1.1.6 Read
      2. 2.1.2  Programming From Image
      3. 2.1.3  Programming From Script
        1. 2.1.3.1 Script Limitations
        2. 2.1.3.2 Command Syntax
        3. 2.1.3.3 Instructions
      4. 2.1.4  Programming in Standalone Mode
      5. 2.1.5  Memory Setup for GO, Erase, Program, Verify, and Read
        1. 2.1.5.1 Writing and Reading BSL Flash Sectors in the MSP430F5xx and MSP430F6xx MCUs
      6. 2.1.6  Secure Device Setup and Memory Protection
      7. 2.1.7  Programming MCU With IP Encapsulated Segment
      8. 2.1.8  Serialization
      9. 2.1.9  Creating and Using Images
      10. 2.1.10 Programming From Image File
      11. 2.1.11 Programming From SD Card
      12. 2.1.12 File Extensions
      13. 2.1.13 Checksum Calculation
      14. 2.1.14 Commands Combined With the Executable File
    2. 2.2 Data Viewers
    3. 2.3 Status Messages
    4. 2.4 Self Test
    5. 2.5 Label
    6. 2.6 Preferences
      1. 2.6.1 USB ID Number
      2. 2.6.2 COM Port
      3. 2.6.3 LCD Contrast
      4. 2.6.4 Checksum – Gang430 Standard
    7. 2.7 Benchmarks
      1. 2.7.1 Benchmarks for MSP430F5xx
      2. 2.7.2 Benchmarks for MSP430FR5xx
      3. 2.7.3 Benchmarks for MSP430F2xx
      4. 2.7.4 Benchmarks for MSP432P401R
  4. 3Firmware
    1. 3.1 Commands
    2. 3.2 Firmware Interface Protocol
    3. 3.3 Synchronization Sequence
    4. 3.4 Command Messages
      1. 3.4.1 Frame Structure
      2. 3.4.2 Checksum
    5. 3.5 Detailed Description of Commands
      1. 3.5.1 General
      2. 3.5.2 Commands Supported by the BOOT Loader
        1. 3.5.2.1  "Hello" Command
        2. 3.5.2.2  Boot Commands Disable
        3. 3.5.2.3  Boot Commands Enable
        4. 3.5.2.4  Get Diagnostic Command
        5. 3.5.2.5  Select Baud Rate Command
        6. 3.5.2.6  Erase Firmware Command
        7. 3.5.2.7  Load Firmware Command
        8. 3.5.2.8  Exit from Firmware Update Command
        9. 3.5.2.9  Get Label Command
        10. 3.5.2.10 Get Progress Status
      3. 3.5.3 Commands Supported by Application Firmware
        1. 3.5.3.1 Select Image Command
        2. 3.5.3.2 Main Process Command
        3. 3.5.3.3 Set Temporary Configuration in MSP-GANG Command
        4. 3.5.3.4 Get Selected Status Command
        5. 3.5.3.5 Read From Gang Data Buffer Command
        6. 3.5.3.6 Write to Gang Data Buffer Command
      4. 3.5.4 API Firmware Commands That Should Not be Used
        1. 3.5.4.1  Interactive Process Command
        2. 3.5.4.2  Erase Image Command
        3. 3.5.4.3  Read Info Memory From MSP-GANG Command
        4. 3.5.4.4  Write to MSP-GANG Info Memory Command
        5. 3.5.4.5  Verify Access Key Command
        6. 3.5.4.6  Write to Image Block Command
        7. 3.5.4.7  Verify Image Check Sum Command
        8. 3.5.4.8  Read Image Header Command
        9. 3.5.4.9  Disable API Interrupts Command
        10. 3.5.4.10 Display Message on LCD Display Command
        11. 3.5.4.11 Set IO State Command
  5. 4Dynamic Link Library for MSP-GANG Programmer
    1. 4.1 Gang430.dll Wrapper Description
    2. 4.2 MSP-GANG.dll Description
      1. 4.2.1  MSPGANG_GetDataBuffers_ptr
      2. 4.2.2  MSPGANG_SetGangBuffer, MSPGANG_GetGangBuffer
      3. 4.2.3  MSPGANG_GetDevice
      4. 4.2.4  MSPGANG_LoadFirmware
      5. 4.2.5  MSPGANG_InitCom
      6. 4.2.6  MSPGANG_ReleaseCom
      7. 4.2.7  MSPGANG_GetErrorString
      8. 4.2.8  MSPGANG_SelectBaudrate
      9. 4.2.9  MSPGANG_GetDiagnostic
      10. 4.2.10 MSPGANG_MainProcess
      11. 4.2.11 MSPGANG_InteractiveProcess
      12. 4.2.12 MSPGANG_Interactive_Open_Target_Device
      13. 4.2.13 MSPGANG_Interactive_Close_Target_Device
      14. 4.2.14 MSPGANG_Interactive_DefReadTargets
      15. 4.2.15 MSPGANG_Interactive_ReadTargets
      16. 4.2.16 MSPGANG_Interactive_ReadBytes
      17. 4.2.17 MSPGANG_Interactive_WriteWord_to_RAM
      18. 4.2.18 MSPGANG_Interactive_WriteByte_to_RAM
      19. 4.2.19 MSPGANG_Interactive_WriteBytes_to_RAM
      20. 4.2.20 MSPGANG_Interactive_WriteBytes_to_FLASH
      21. 4.2.21 MSPGANG_Interactive_Copy_Gang_Buffer_to_RAM
      22. 4.2.22 MSPGANG_Interactive_Copy_Gang_Buffer_to_FLASH
      23. 4.2.23 MSPGANG_Interactive_EraseSectors
      24. 4.2.24 MSPGANG_Interactive_BlankCheck
      25. 4.2.25 MSPGANG_Interactive_DCO_Test
      26. 4.2.26 MSPGANG_SelectImage
      27. 4.2.27 MSPGANG_EraseImage
      28. 4.2.28 MSPGANG_CreateGangImage
      29. 4.2.29 MSPGANG_LoadImageBlock
      30. 4.2.30 MSPGANG_VerifyPSAImageBlock
      31. 4.2.31 MSPGANG_ReadImageBlock
      32. 4.2.32 MSPGANG_Read_Code_File
      33. 4.2.33 MSPGANG_Save_Config, MSPGANG_Load_Config, MSPGANG_Default_Config
      34. 4.2.34 MSPGANG_SetConfig, MSPGANG_GetConfig
      35. 4.2.35 MSPGANG_GetNameConfig, MSPGANG_SetNameConfig
      36. 4.2.36 MSPGANG_SetTmpGANG_Config
      37. 4.2.37 MSPGANG_GetLabel
      38. 4.2.38 MSPGANG_GetInfoMemory, MSPGANG_SetInfoMemory
      39. 4.2.39 MSPGANG_Get_qty_MCU_Type, MSPGANG_Set_MCU_Type, MSPGANG_Get_MCU_TypeName, MSPGANG_Get_qty_MCU_Family, MSPGANG_Get_MCU_FamilyName, MSPGANG_Get_MCU_Name
      40. 4.2.40 MSPGANG_Set_MCU_Name
      41. 4.2.41 MSPGANG_HW_devices
      42. 4.2.42 MSPGANG_GetProgressStatus
      43. 4.2.43 MSPGANG_GetAPIStatus
      44. 4.2.44 MSPGANG_Set_IO_State
      45. 4.2.45 MSPGANG_Convert_Address
      46. 4.2.46 MSPGANG_Memory_Header_text
      47. 4.2.47 MSPGANG_Interactive_ClrLockedDevice
      48. 4.2.48 MSPGANG_Get_Code_Info
      49. 4.2.49 MSPGANG_MakeSound
      50. 4.2.50 MSPGANG_CallBack_ProgressBar
      51. 4.2.51 MSPGANG_GetPCHardwareFingerprint
      52. 4.2.52 MSPGANG_Flash_valid_addr
  6. 5Schematics
    1. 5.1 Schematics
  7. 6Frequently Asked Questions
    1. 6.1 Question: Why does device init, connect, or programming fail?
    2. 6.2 Question: Can I use single wires for connection between MSP-GANG and target device?
    3. 6.3 Question: How to serialize parts?
    4. 6.4 Question: How to have parts run after programming?
    5. 6.5 Question: What are possible reasons for the part to fail Verify step?
  8.   Revision History

6.2 Question: Can I use single wires for connection between MSP-GANG and target device?

Answer: Single wires are a poor type of connection and provide very bad quality. Single wires work like inductors connected between the MSP-GANG and target device, generating ripples on the target device side. If a ribbon cable cannot be used, then a twisted-pairs connection should be used instead. One wire on each twisted pair should be connected to a signal connection (for example, TDI or TCK), and the second wire connected to DC (GND or VCC) from both sides of the connection (one on the MSP-GANG side and the other on the target device side). For example, the following arrangement is acceptable:

1 - TDO (Signal wire) - first twisted pair 1 - Vcc / Vcc sense (DC wire) 2 - TDI (Signal wire) - second twisted pair 2 - Vcc sense (DC wire) 3 - TMS (Signal wire) - third twisted pair 3 - RESET (DC wire) 4 - TCK (Signal wire) - fourth twisted pair 4 - GND (DC wire)

If additional protecting components (such as a capacitor or suppressors) are used on the target device PCB, check the JTAG signal shape on the MSP MCU. The JTAG communication speed should be decreased (set to medium or slow) if required. Make sure that any ripple on the JTAG lines is smaller than 20% of the peak-to-peak signal level.

If connection cables are longer than 40 cm, then the ripple can be reduced by inserting 33-Ω resistors in series with TCK, TMS, and TDO in the middle of the connection wires. Do not provide series resistors in TEST and TDI lines if the device will be secured (blown the security fuse) for MSP families 1xx, 2xx, and 4xx. For blowing the security fuse in these devices, the programmer provides Vpp 6.5 V at 100 mA on the TEST or TDI lines to MSP MCU. An additional resistor inserted in these lines can reduce the maximum current provided to the MCU and the security fuse will not be blown.
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