SLAU739 October   2017

 

  1.   MSP430FR2433 LaunchPad™ Development Kit (MSP‑EXP430FR2433)
    1.     Trademarks
    2. 1 Getting Started
      1. 1.1 Introduction
      2. 1.2 Key Features
      3. 1.3 What's Included
        1. 1.3.1 Kit Contents
        2. 1.3.2 Software Examples
      4. 1.4 First Steps: Out-of-Box Experience
        1. 1.4.1 Connecting to the Computer
        2. 1.4.2 Running the Out-of-Box Demo
      5. 1.5 Next Steps: Looking Into the Provided Code
    3. 2 Hardware
      1. 2.1 Block Diagram
      2. 2.2 Hardware Features
        1. 2.2.1 MSP430FR2433 MCU
        2. 2.2.2 eZ-FET Onboard Debug Probe With EnergyTrace Technology
        3. 2.2.3 Debug Probe Connection: Isolation Jumper Block
        4. 2.2.4 Application (or Backchannel) UART
        5. 2.2.5 Optional Features
          1. 2.2.5.1 Supercapacitor
      3. 2.3 Power
        1. 2.3.1 eZ-FET USB Power
        2. 2.3.2 BoosterPack and External Power Supply
        3. 2.3.3 Supercap (C6)
          1. 2.3.3.1 Charging the Supercap
          2. 2.3.3.2 Using the Supercap
          3. 2.3.3.3 Disabling the Supercap
      4. 2.4 Measure Current Draw of the MSP430 MCU
      5. 2.5 Clocking
      6. 2.6 Using the eZ-FET Debug Probe With a Different Target
      7. 2.7 BoosterPack Pinout
      8. 2.8 Design Files
        1. 2.8.1 Hardware
        2. 2.8.2 Software
      9. 2.9 Hardware Change log
    4. 3 Software Examples
      1. 3.1 Out-of-Box Software Example
        1. 3.1.1 Source File Structure
        2. 3.1.2 Overview
        3. 3.1.3 FRAM Data Logging Mode
        4. 3.1.4 Live Temperature Mode
      2. 3.2 Blink LED Example
        1. 3.2.1 Source File Structure
    5. 4 Resources
      1. 4.1 Integrated Development Environments
        1. 4.1.1 TI Cloud Development Tools
          1. 4.1.1.1 TI Resource Explorer Cloud
          2. 4.1.1.2 Code Composer Studio Cloud
        2. 4.1.2 Code Composer Studio IDE
        3. 4.1.3 IAR Embedded Workbench for Texas Instruments 430
      2. 4.2 LaunchPad Websites
      3. 4.3 MSPWare and TI Resource Explorer
      4. 4.4 FRAM Utilities
        1. 4.4.1 Compute Through Power Loss (CTPL)
        2. 4.4.2 Nonvolatile Storage (NVS)
      5. 4.5 MSP430FR2433 MCU
        1. 4.5.1 Device Documentation
        2. 4.5.2 MSP430FR2433 Code Examples
        3. 4.5.3 MSP430 Application Notes and TI Designs
      6. 4.6 Community Resources
        1. 4.6.1 TI E2E Community
        2. 4.6.2 Community at Large
    6. 5 FAQ
    7. 6 Schematics

2.3.3.3 Disabling the Supercap

The supercapacitor can be completely decoupled from the board by removing the J4 jumper. Hanging this jumper off only one pin can prevent losing the jumper.
千亿体育app官网登录(中国)官方网站IOS/安卓通用版/手机APP | 米乐app下载官网（中国）|ios|Android/通用版APP最新版 | 米乐|米乐·M6（中国大陆）官方网站 | 千亿体育登陆地址 | 华体会体育（中国）HTH·官方网站 | 千赢qy国际_全站最新版千赢qy国际V6.2.14安卓/IOS下载 | 18新利网v1.2.5|中国官方网站 | bob电竞真人（中国官网）安卓/ios苹果/电脑版【1.97.95版下载】 | 千亿体育app官方下载(中国)官方网站IOS/安卓/手机APP下载安装 |