SLAU802 March   2019

 

  1.   MSP430FR2476 LaunchPad™ Development Kit (LP‑MSP430FR2476)
    1.     Trademarks
    2. 1 Getting Started
      1. 1.1 Introduction
      2. 1.2 Key Features
      3. 1.3 What’s Included
        1. 1.3.1 Kit Contents
        2. 1.3.2 Software Examples
      4. 1.4 First Steps: Out-of-Box Experience
        1. 1.4.1 Connecting to the Computer
        2. 1.4.2 Running the Out-of-Box Experience (OOBE)
      5. 1.5 Next Steps: Looking Into the Provided Code
    3. 2 Hardware
      1. 2.1 Block Diagram
      2. 2.2 Hardware Features
        1. 2.2.1 MSP430FR2476 MCU
        2. 2.2.2 eZ-FET Onboard Debug Probe With EnergyTrace™ Technology
        3. 2.2.3 Debug Probe Connection: Isolation Jumper Block
        4. 2.2.4 Application (or Backchannel) UART
        5. 2.2.5 Special Features
          1. 2.2.5.1 TMP235 Temperature Sensor
          2. 2.2.5.2 CR2032 Coin Cell Battery
      3. 2.3 Power
        1. 2.3.1 eZ-FET USB Power
        2. 2.3.2 CR2032 Battery Power
        3. 2.3.3 BoosterPack Plug-in Module and External Power Supply
      4. 2.4 Measure Current Draw of the MSP430 MCU
      5. 2.5 Clocking
      6. 2.6 Using the eZ-FET Debug Probe With a Different Target
      7. 2.7 BoosterPack Plug-in Module Pinout
      8. 2.8 Design Files
        1. 2.8.1 Hardware
        2. 2.8.2 Software
      9. 2.9 Hardware Change Log
    4. 3 Software Examples
      1. 3.1 Out-of-Box Software Example
        1. 3.1.1 Source File Structure
        2. 3.1.2 Overview
      2. 3.2 Blink LED Example
        1. 3.2.1 Source File Structure
    5. 4 Resources
      1. 4.1 Integrated Development Environments
        1. 4.1.1 TI Cloud Development Tools
          1. 4.1.1.1 TI Resource Explorer Cloud
          2. 4.1.1.2 Code Composer Studio Cloud
        2. 4.1.2 Code Composer Studio IDE
        3. 4.1.3 IAR Embedded Workbench for MSP430 IDE
      2. 4.2 LaunchPad Development Kit Websites
      3. 4.3 MSP430Ware and TI Resource Explorer
      4. 4.4 FRAM Utilities
        1. 4.4.1 Compute Through Power Loss
        2. 4.4.2 Nonvolatile Storage (NVS)
      5. 4.5 MSP430FR2476 MCU
        1. 4.5.1 Device Documentation
        2. 4.5.2 MSP430FR2476 Code Examples
        3. 4.5.3 MSP430 Application Notes and TI Designs
      6. 4.6 Community Resources
        1. 4.6.1 TI E2E Community
        2. 4.6.2 Community at Large
    6. 5 FAQ
    7. 6 Schematics

2.3.3 BoosterPack Plug-in Module and External Power Supply

Headers J6 is present on the board to supply external power directly. It is important to comply with the device voltage operation specifications when supplying external power. The MSP430FR2476 has an operating range of 1.8 V to 3.6 V. More information can be found in the MSP430FR247x Mixed-Signal Microcontrollers data sheet.
千亿体育app官网登录(中国)官方网站IOS/安卓通用版/手机APP | 米乐app下载官网（中国）|ios|Android/通用版APP最新版 | 米乐|米乐·M6（中国大陆）官方网站 | 千亿体育登陆地址 | 华体会体育（中国）HTH·官方网站 | 千赢qy国际_全站最新版千赢qy国际V6.2.14安卓/IOS下载 | 18新利网v1.2.5|中国官方网站 | bob电竞真人（中国官网）安卓/ios苹果/电脑版【1.97.95版下载】 | 千亿体育app官方下载(中国)官方网站IOS/安卓/手机APP下载安装 |