SLAU802 March   2019

 

  1.   MSP430FR2476 LaunchPad™ Development Kit (LP‑MSP430FR2476)
    1.     Trademarks
    2. 1 Getting Started
      1. 1.1 Introduction
      2. 1.2 Key Features
      3. 1.3 What’s Included
        1. 1.3.1 Kit Contents
        2. 1.3.2 Software Examples
      4. 1.4 First Steps: Out-of-Box Experience
        1. 1.4.1 Connecting to the Computer
        2. 1.4.2 Running the Out-of-Box Experience (OOBE)
      5. 1.5 Next Steps: Looking Into the Provided Code
    3. 2 Hardware
      1. 2.1 Block Diagram
      2. 2.2 Hardware Features
        1. 2.2.1 MSP430FR2476 MCU
        2. 2.2.2 eZ-FET Onboard Debug Probe With EnergyTrace™ Technology
        3. 2.2.3 Debug Probe Connection: Isolation Jumper Block
        4. 2.2.4 Application (or Backchannel) UART
        5. 2.2.5 Special Features
          1. 2.2.5.1 TMP235 Temperature Sensor
          2. 2.2.5.2 CR2032 Coin Cell Battery
      3. 2.3 Power
        1. 2.3.1 eZ-FET USB Power
        2. 2.3.2 CR2032 Battery Power
        3. 2.3.3 BoosterPack Plug-in Module and External Power Supply
      4. 2.4 Measure Current Draw of the MSP430 MCU
      5. 2.5 Clocking
      6. 2.6 Using the eZ-FET Debug Probe With a Different Target
      7. 2.7 BoosterPack Plug-in Module Pinout
      8. 2.8 Design Files
        1. 2.8.1 Hardware
        2. 2.8.2 Software
      9. 2.9 Hardware Change Log
    4. 3 Software Examples
      1. 3.1 Out-of-Box Software Example
        1. 3.1.1 Source File Structure
        2. 3.1.2 Overview
      2. 3.2 Blink LED Example
        1. 3.2.1 Source File Structure
    5. 4 Resources
      1. 4.1 Integrated Development Environments
        1. 4.1.1 TI Cloud Development Tools
          1. 4.1.1.1 TI Resource Explorer Cloud
          2. 4.1.1.2 Code Composer Studio Cloud
        2. 4.1.2 Code Composer Studio IDE
        3. 4.1.3 IAR Embedded Workbench for MSP430 IDE
      2. 4.2 LaunchPad Development Kit Websites
      3. 4.3 MSP430Ware and TI Resource Explorer
      4. 4.4 FRAM Utilities
        1. 4.4.1 Compute Through Power Loss
        2. 4.4.2 Nonvolatile Storage (NVS)
      5. 4.5 MSP430FR2476 MCU
        1. 4.5.1 Device Documentation
        2. 4.5.2 MSP430FR2476 Code Examples
        3. 4.5.3 MSP430 Application Notes and TI Designs
      6. 4.6 Community Resources
        1. 4.6.1 TI E2E Community
        2. 4.6.2 Community at Large
    6. 5 FAQ
    7. 6 Schematics

2.8.1 Hardware

Schematics can be found in Section 6. All design files including schematics, layout, bill of materials (BOM), Gerber files, and documentation are available in the LP-MSP430FR2476 design files.

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