SLAU802 March   2019

 

  1.   MSP430FR2476 LaunchPad™ Development Kit (LP‑MSP430FR2476)
    1.     Trademarks
    2. 1 Getting Started
      1. 1.1 Introduction
      2. 1.2 Key Features
      3. 1.3 What’s Included
        1. 1.3.1 Kit Contents
        2. 1.3.2 Software Examples
      4. 1.4 First Steps: Out-of-Box Experience
        1. 1.4.1 Connecting to the Computer
        2. 1.4.2 Running the Out-of-Box Experience (OOBE)
      5. 1.5 Next Steps: Looking Into the Provided Code
    3. 2 Hardware
      1. 2.1 Block Diagram
      2. 2.2 Hardware Features
        1. 2.2.1 MSP430FR2476 MCU
        2. 2.2.2 eZ-FET Onboard Debug Probe With EnergyTrace™ Technology
        3. 2.2.3 Debug Probe Connection: Isolation Jumper Block
        4. 2.2.4 Application (or Backchannel) UART
        5. 2.2.5 Special Features
          1. 2.2.5.1 TMP235 Temperature Sensor
          2. 2.2.5.2 CR2032 Coin Cell Battery
      3. 2.3 Power
        1. 2.3.1 eZ-FET USB Power
        2. 2.3.2 CR2032 Battery Power
        3. 2.3.3 BoosterPack Plug-in Module and External Power Supply
      4. 2.4 Measure Current Draw of the MSP430 MCU
      5. 2.5 Clocking
      6. 2.6 Using the eZ-FET Debug Probe With a Different Target
      7. 2.7 BoosterPack Plug-in Module Pinout
      8. 2.8 Design Files
        1. 2.8.1 Hardware
        2. 2.8.2 Software
      9. 2.9 Hardware Change Log
    4. 3 Software Examples
      1. 3.1 Out-of-Box Software Example
        1. 3.1.1 Source File Structure
        2. 3.1.2 Overview
      2. 3.2 Blink LED Example
        1. 3.2.1 Source File Structure
    5. 4 Resources
      1. 4.1 Integrated Development Environments
        1. 4.1.1 TI Cloud Development Tools
          1. 4.1.1.1 TI Resource Explorer Cloud
          2. 4.1.1.2 Code Composer Studio Cloud
        2. 4.1.2 Code Composer Studio IDE
        3. 4.1.3 IAR Embedded Workbench for MSP430 IDE
      2. 4.2 LaunchPad Development Kit Websites
      3. 4.3 MSP430Ware and TI Resource Explorer
      4. 4.4 FRAM Utilities
        1. 4.4.1 Compute Through Power Loss
        2. 4.4.2 Nonvolatile Storage (NVS)
      5. 4.5 MSP430FR2476 MCU
        1. 4.5.1 Device Documentation
        2. 4.5.2 MSP430FR2476 Code Examples
        3. 4.5.3 MSP430 Application Notes and TI Designs
      6. 4.6 Community Resources
        1. 4.6.1 TI E2E Community
        2. 4.6.2 Community at Large
    6. 5 FAQ
    7. 6 Schematics

1.4.2 Running the Out-of-Box Experience (OOBE)

The OOBE of the LP-MSP430FR2476 LaunchPad development kit demonstrates how to implement a simple thermometer by using the internal ADC of the MSP430FR2476 MCU to measure the output voltage from an analog temperature sensor.

When powering up the Out-of-Box demo, the board performs an initial temperature calibration and illuminates RGB LED2 in a green color. Try to heat the temperature sensor U1 by blowing hot air on it to see if you can get LED2 to turn red or using a compressed air can to blow cold air onto the sensor to see LED2 turn blue. LED2 indicates the relative difference between the current temperature and the calibrated measurement.

Press button S1 to recalibrate the temperature to the most recent measurement and send a UART message (at 9600 baud) containing the new calibrated temperature through the backchannel UART. Press button S2 at any time to send a UART message containing the current ambient temperature measurement in Celsius.
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