米6体育平台手机版

SLDA021B March 2014 – February 2020 AM3892 , AM3894

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7.2 Automatic X-Ray Inspection (AXI)

The 3-dimensional AXI is the best available method for BGA solder defect detection in production environments. Due to the possibility of false calls, however, defects should be verified visually or with 2-D X-ray analysis before any rework is performed.