SLDA021B March 2014 – February 2020 AM3892 , AM3894
All components are checked for 100% ball presence as part of TI’s extensive quality assurance procedure. However, balls can occasionally get removed, generally due to improper handling in transit from the BGA packaging facility to the assembler’s production line. It is suggested that a ball presence check be performed by the placement machine vision system. If the vision system is not capable of checking all balls, it should be programmed to check as many as possible.