米6体育平台手机版

SLDA021B March 2014 – February 2020 AM3892 , AM3894

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6.3 Cleanliness Testing

Overall assembly cleanliness may be assessed with an ionograph; however, this test method averages the detected contamination over the entire surface area of the PCB and is not a direct indicator of complete flux residue removal from underneath the component. Ion chromatography of the PCB area under the component is the best way to validate cleanliness during assembly process development. The innermost area of the device should be tested, as shown in Figure 5.

Figure 5. Example of Key Area to Test for Complete Flux Residue Removal