米6体育平台手机版

SLDA021B March 2014 – February 2020 AM3892 , AM3894

1
1. 2
2. 3
  1. 4
    1. 5
  2. 6
3. 7
  1. 8
    1. 9
  2. 10
    1. 11
    2. 12
      1. 13
  3. 14
  4. 15
4. 16
  1. 17
  2. 18
  3. 19
  4. 20
5. 21
  1. 22
    1. 23
  2. 24
  3. 25
  4. 26
  5. 27
  6. 28
  7. 29
  8. 30
6. 31
  1. 32
  2. 33
  3. 34
  4. 35
  5. 36
  6. 37
7. 38
  1. 39
  2. 40
  3. 41
  4. 42
8. 43
  1. 44
  2. 45
  3. 46
  4. 47
9. 48
  1. 49
  2. 50
  3. 51
  4. 52
  5. 53
  6. 54
  7. 55
    1. 56
    2. 57
  8. 58
  9. 59
  10. 60
10. 61
11. 62
  1. 63
  2. 64
12. 65
66

4.2 Electrostatic Discharge Sensitive Devices (ESDS)

All electronic components can be damaged by electrostatic discharge (ESD) throughout their life cycle. Static charge is produced whenever there is movement. ESD controls help to reduce charge generation, limit potential differences between objects (grounding), neutralize charges (ionizers), and remove field effects.

Devices assembled in flip chip BGA packages should be considered ESD-sensitive. Care in handling should be used when processing FCBGA packages.