米6体育平台手机版

SLDA021B March 2014 – February 2020 AM3892 , AM3894

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4.8 Placement Accuracy and Self-Centering

Fine Pitch placement machines should typically place components within 25 μm (0.001") of the programmed location.

To simulate a worst-case scenario, placement was tested with 100-μm (0.004") offsets in both X and Y directions concurrently. In this test, components all self-centered, no soldering defects were formed, and no solder balls were observed under X-ray inspection.