米6体育平台手机版

SLDA021B March 2014 – February 2020 AM3892 , AM3894

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8.2 Pre-bake

Prior to rework, the assembly should be baked for 24 hours at 105°C to remove any absorbed moisture into the PCB or components. If heat-sensitive components are on the PCB, they should be removed before the pre-bake step of the process.