米6体育平台手机版

SLDA021B March 2014 – February 2020 AM3892 , AM3894

1
1. 2
2. 3
  1. 4
    1. 5
  2. 6
3. 7
  1. 8
    1. 9
  2. 10
    1. 11
    2. 12
      1. 13
  3. 14
  4. 15
4. 16
  1. 17
  2. 18
  3. 19
  4. 20
5. 21
  1. 22
    1. 23
  2. 24
  3. 25
  4. 26
  5. 27
  6. 28
  7. 29
  8. 30
6. 31
  1. 32
  2. 33
  3. 34
  4. 35
  5. 36
  6. 37
7. 38
  1. 39
  2. 40
  3. 41
  4. 42
8. 43
  1. 44
  2. 45
  3. 46
  4. 47
9. 48
  1. 49
  2. 50
  3. 51
  4. 52
  5. 53
  6. 54
  7. 55
    1. 56
    2. 57
  8. 58
  9. 59
  10. 60
10. 61
11. 62
  1. 63
  2. 64
12. 65
66

5.3 Reflow Profile Considerations

The solder paste manufacturer’s guidelines for reflow parameters should be applied when profiling PCBs. The components have soldered satisfactorily in tests with peak temperatures ranging from 230°C to 240°C, and TALs from 45 to 150 seconds.

The component’s body temperature should not exceed 260°C at any time during the reflow process.

The component’s body temperature should not exceed 255°C for more than 30 seconds.

An example of a typical soak profile is shown in Figure 4. It is a soak-style profile; straight ramp-style profiles such as the one seen in Figure 8 (rework section) are also acceptable.

Figure 4. Sample Reflow Profile