米6体育平台手机版

SLDA021B March 2014 – February 2020 AM3892 , AM3894

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3.1 Solder Paste Selection

The FCBGA is compatible with a broad range of commercially available Type 3 (mesh size –325/+500, particle size 25-45 µm) and Type 4 (mesh size –400/+625, particle size 20–38µm) solder pastes.

The component has been assembly tested with both no-clean and water-washable lead-free solder paste products. Due to the I/O density and low package standoff, no clean solder processes are recommended. If water-washable assembly materials are used, cleaning process information is presented in Section 6.