米6体育平台手机版

SLDA021B March 2014 – February 2020 AM3892 , AM3894

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3.3 Stencil Print Registration

Figure 3. Preferred Solder Paste Alignment

Ideally, paste prints should be centered on the PCB pad, as seen in Figure 3 Mis-registration of up to 50 µm (0.002”) in X and/or Y directions is acceptable. Print offsets greater than 50 μm (0.002”),are not acceptable and the print should be rejected.