SLDA021B March 2014 – February 2020 AM3892 , AM3894
Table 3 lists the basic design recommendations for a WiLink 8 FCBGA PCB.
Design Area/Parameter | ||
---|---|---|
Pad Design Recommendations | Pad geometry (mm) | 0.32 |
Pad opening (mm, NSMD) | 0.45 | |
PCB Assembly Recommendations | Solder paste type (Pb-free) | Sn/Ag/Cu-based |
Stencil thickness (mm) | 0.10 to 0.125 | |
Recommended PCB surface finish | OSP | |
Maximum reflow temperature (°C) | +260°C | |
Maximum reflow time (sec) | 40 to 60 | |
Maximum soak temperature (°C) | +180°C | |
Maximum soak time (sec) | 90 sec | |
# Reflow maximum | Maximum 3 | |
Package Storage Information | Storage conditions | ≤ 30°C/85% RH |
Moisture sensitvity level (MSL) | L3 | |
Possible prebake recommendations | 125C/24H |