SLDA021B March   2014  – February 2020 AM3892 , AM3894

 

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Summary of PCB Design Recommendations

Table 3 lists the basic design recommendations for a WiLink 8 FCBGA PCB.

Table 3. WiLink 8Q FCBGA Package Circuit Board Design Recommendations

Design Area/Parameter
Pad Design Recommendations Pad geometry (mm) 0.32
Pad opening (mm, NSMD) 0.45
PCB Assembly Recommendations Solder paste type (Pb-free) Sn/Ag/Cu-based
Stencil thickness (mm) 0.10 to 0.125
Recommended PCB surface finish OSP
Maximum reflow temperature (°C) +260°C
Maximum reflow time (sec) 40 to 60
Maximum soak temperature (°C) +180°C
Maximum soak time (sec) 90 sec
# Reflow maximum Maximum 3
Package Storage Information Storage conditions ≤ 30°C/85% RH 
Moisture sensitvity level (MSL) L3
Possible prebake recommendations 125C/24H