SLLA539B November   2020  – December 2021 TCAN1051-Q1 , TCAN1051G-Q1 , TCAN1051GV-Q1 , TCAN1051H-Q1 , TCAN1051HG-Q1 , TCAN1051HGV-Q1 , TCAN1051HV-Q1 , TCAN1051V-Q1

 

  1.   Trademarks
  2. 1Overview
  3. 2Functional Safety Failure In Time (FIT) Rates
  4. 3Failure Mode Distribution (FMD)
  5. 4Pin Failure Mode Analysis (Pin FMA)
    1. 4.1 SOIC and VSON Packages
  6. 5Revision History

Pin Failure Mode Analysis (Pin FMA)

This section provides a Failure Mode Analysis (FMA) for the pins of TCAN1051-Q1 and TCAN1051V-Q1 (as well as the TCAN1051H-Q1, TCAN1051G-Q1, TCAN1051HV-Q1, TCAN1051GV-Q1, TCAN1051HG-Q1 and TCAN1051HGV-Q1). The failure modes covered in this document include the typical pin-by-pin failure scenarios:

Table 4-2 through Table 4-7 also indicate how these pin conditions can affect the device as per the failure effects classification in Table 4-1.

Table 4-1 TI Classification of Failure Effects
ClassFailure Effects
APotential device damage that affects functionality
BNo device damage, but loss of functionality
CNo device damage, but performance degradation
DNo device damage, no impact to functionality or performance

Following are the assumptions of use and the device configuration assumed for the pin FMA in this section:

  • VCC = 4.5 to 5.5V
  • VBAT = 6 to 24V
  • VIO = 3 to 5.5V