SLLSER8J June   2017  – August 2024

PRODUCTION DATA  

1.   1
2. 1 Features
3. 2 Applications
4. 3 Description
5. 4 Device Comparison Table
6. 5 Pin Configuration and Function
7. 6 Specifications
   1. 6.1  Absolute Maximum Ratings
   2. 6.2  ESD Ratings
   3. 6.3  Recommended Operating Conditions
   4. 6.4  Thermal Information
   5. 6.5  Power Ratings
   6. 6.6  Insulation Specifications for D Package
   7. 6.7  Insulation Specifications for DWV Package
   8. 6.8  Safety-Related Certifications For D Package
   9. 6.9  Safety-Related Certifications For DWV Package
   10. 6.10 Safety Limiting Values
   11. 6.11 Electrical Characteristics
   12. 6.12 Switching Characteristics
   13. 6.13 Insulation Characteristics Curves
   14. 6.14 Typical Characteristics
8. 7 Parameter Measurement Information
   1. 7.1 Propagation Delay, Inverting, and Noninverting Configuration
      1. 7.1.1 CMTI Testing
9. 8 Detailed Description
   1. 8.1 Overview
   2. 8.2 Functional Block Diagram
   3. 8.3 Feature Description
      1. 8.3.1 Power Supply
      2. 8.3.2 Input Stage
      3. 8.3.3 Output Stage
      4. 8.3.4 Protection Features
         1. 8.3.4.1 Undervoltage Lockout (UVLO)
         2. 8.3.4.2 Active Pulldown
         3. 8.3.4.3 Short-Circuit Clamping
         4. 8.3.4.4 Active Miller Clamp (UCC53x0M)
   4. 8.4 Device Functional Modes
      1. 8.4.1 ESD Structure
10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
       1. 9.2.1 Design Requirements
       2. 9.2.2 Detailed Design Procedure
          1. 9.2.2.1 Designing IN+ and IN– Input Filter
          2. 9.2.2.2 Gate-Driver Output Resistor
          3. 9.2.2.3 Estimate Gate-Driver Power Loss
          4. 9.2.2.4 Estimating Junction Temperature
       3. 9.2.3 Selecting VCC1 and VCC2 Capacitors
          1. 9.2.3.1 Selecting a VCC1 Capacitor
          2. 9.2.3.2 Selecting a VCC2 Capacitor
          3. 9.2.3.3 Application Circuits with Output Stage Negative Bias
       4. 9.2.4 Application Curve
11. 10Power Supply Recommendations
12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 PCB Material
13. 12Device and Documentation Support
    1. 12.1 Device Support
       1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Documentation Support
       1. 12.2.1 Related Documentation
    3. 12.3 Certifications
    4. 12.4 Receiving Notification of Documentation Updates
    5. 12.5 Support Resources
    6. 12.6 Trademarks
    7. 12.7 Electrostatic Discharge Caution
    8. 12.8 Glossary
14. 13Revision History
15. 14Mechanical, Packaging, and Orderable Information