SLOS265E August   1999  – March 2024

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information: THS4021
    5. 5.5 Thermal Information: THS4022
    6. 5.6 Electrical Characteristics: THS4021D and THS4022DGN
    7. 5.7 Electrical Characteristics: THS4021DGN
    8. 5.8 Typical Characteristics: THS4021D and THS4022DGN
    9. 5.9 Typical Characteristics: THS4021DGN
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Offset Nulling
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Driving a Capacitive Load
      2. 7.1.2 General Configuration
    2. 7.2 Power Supply Recommendations
    3. 7.3 Layout
      1. 7.3.1 Layout Guidelines
        1. 7.3.1.1 General PowerPAD™ Integrated Circuit Package Design Considerations
      2. 7.3.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

5.4 Thermal Information: THS4021

THERMAL METRIC(1) THS4021 UNIT
D (SOIC) DGN (HVSSOP)
8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 124.5 58.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 65.0 4.7 °C/W
RθJB Junction-to-board thermal resistance 72.2 N/A °C/W
ΨJT Junction-to-top characterization parameter 13.6 N/A °C/W
ΨJB Junction-to-board characterization parameter 71.4 N/A °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A °C/W
(1) For information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
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