In-via pads are required in this device. Via interconnect on GND is critical for thermal performance.
Place the AC capacitors (C6, C7, C8) close to the coil connection keeping the trace thick to lower its resistance.
Output and RECT capacitors should be placed close to the OUT and RECT pins in the IC.
BOOT, COMM and CLAP capacitors should be placed close to the pins. If vias are required, it is recommended to shield the traces from sensing traces to avoid interferences.
Preferably provide a ground copper area underneath the sensing traces, REC, ILIM, FOD to shield them from the power and noisy traces.