This section provides Functional Safety Failure In
Time (FIT) rates for TPS62850x-Q1 based on two different industry-wide used
reliability standards:
- Table 2-1 provides FIT rates based on IEC TR 62380 / ISO 26262 part 11
- Table 2-2
provides FIT rates based on the Siemens Norm SN
29500-2
Table 2-1 Component Failure Rates per IEC TR 62380 / ISO 26262 Part 11FIT IEC TR 62380 / ISO 26262 | FIT (Failures Per 109 Hours) |
---|
Total Component FIT Rate | 6 |
Die FIT Rate | 4 |
Package FIT Rate | 2 |
The failure rate and mission profile information
in Table 2-1
comes from the Reliability data handbook IEC TR
62380 / ISO 26262 part 11:
- Mission Profile: Automotive Control
- Power dissipation:
250
mW
- Climate type: World-wide Table 8
- Package factor (lambda 3): Table 17b
- Substrate Material:
FR4
- EOS FIT rate assumed: 0 FIT
Table 2-2 Component Failure Rates per Siemens Norm SN
29500-2T
Table
|
Category
|
Reference FIT Rate
|
Reference Virtual Tj
|
5
|
CMOS, BICMOS Digital, analog/mixed
|
25 FIT
|
55°C
|
The Reference FIT Rate and Reference
Virtual T
j (junction temperature) in
Table 2-2
come from the Siemens Norm SN 29500-2 tables 1
through 5. Failure rates under operating
conditions are calculated from the reference
failure rate and virtual junction temperature
using conversion infromation in SN 29500-2 section
4.