SLUSCK0G November 2017 – November 2024
PRODUCTION DATA
- 1
- 1 Features
- 2 Applications
- 3 Description
- 4 Device Comparison Table
- 5 Pin Configuration and Functions
- 6 Specifications
- 7 Parameter Measurement Information
- 8 Detailed Description
-
9 Application and Implementation
- 9.1 Application Information
- 9.2
Typical Application
- 9.2.1 Design Requirements
- 9.2.2
Detailed Design Procedure
- 9.2.2.1 Designing INA/INB Input Filter
- 9.2.2.2 Select External Bootstrap Diode and its Series Resistor
- 9.2.2.3 Gate Driver Output Resistor
- 9.2.2.4 Estimating Gate Driver Power Loss
- 9.2.2.5 Estimating Junction Temperature
- 9.2.2.6 Selecting VCCI, VDDA/B Capacitor
- 9.2.2.7 Application Circuits with Output Stage Negative Bias
- 9.2.3 Application Curves
- 10Power Supply Recommendations
- 11Layout
- 12Device and Documentation Support
- 13Revision History
- 14Mechanical, Packaging, and Orderable Information
11.2 Layout Example
Figure 11-1 shows a 2-layer PCB layout example with the signals and key components labeled.
Figure 11-1 Layout ExampleFigure 11-2 and Figure 11-3 shows top and bottom layer traces and copper.
There are no PCB traces or copper between the primary and secondary side, which ensures isolation performance.
PCB traces between the high-side and low-side gate drivers in the output stage are increased to maximize the creepage distance for high-voltage operation, which will also minimize cross-talk between the switching node VSSA (SW), where high dv/dt may exist, and the low-side gate drive due to the parasitic capacitance coupling.
Figure 11-4 and Figure 11-5 are 3D layout pictures with top view and bottom views.
The location of the PCB cutout between the primary side and secondary sides, which ensures isolation performance.
