SLUSCO1B June   2017  – July 2024 UCC27212

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Timing Diagrams
    8. 5.8 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Input Stages
      2. 6.3.2 Undervoltage Lockout (UVLO)
      3. 6.3.3 Level Shift
      4. 6.3.4 Boot Diode
      5. 6.3.5 Output Stages
    4. 6.4 Device Functional Modes
  8. Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Power Dissipation
      3. 7.2.3 Application Curves
  9. Power Supply Recommendations
  10. Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
      1. 9.2.1 Thermal Considerations
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Overview

The UCC27212 device is designed to drive both the high-side and low-side of N-Channel MOSFETs in a half- and full-bridge or synchronous-buck configuration. The floating high-side driver can operate with supply voltages of up to 120V, which allows for N-Channel MOSFET control in half-bridge, full-bridge, push-pull, two-switch forward, and active clamp forward converters.

The UCC27212 device feature 3.7A source and 4.5A sink capability, industry best-in-class switching characteristics and a host of other features listed in Table 6-1. These features combine to ensure efficient, robust and reliable operation in high-frequency switching power circuits.

Table 6-1 UCC27212 Highlights
FEATUREBENEFIT
3.7A source and 4.5A sink current High peak current ideal for driving large power MOSFETs with minimal power loss (fast-drive capability at Miller plateau)
Input pins (HI and LI) can directly handle –10VDC up to 20VDCIncreased robustness and ability to handle undershoot and overshoot can interface directly to gate-drive transformers without having to use rectification diodes.
120V internal boot diodeProvides voltage margin to meet telecom 100V surge requirements
Switch node (HS pin) able to handle –(24 – VDD) V maximum for 100nsAllows the high-side channel to have extra protection from inherent negative voltages caused by parasitic inductance and stray capacitance
Robust ESD circuitry to handle voltage spikesExcellent immunity to large dV/dT conditions
20ns propagation delay with 7.2ns rise time and 5.5ns fall timeBest-in-class switching characteristics and extremely low-pulse transmission distortion
4ns (typical) delay matching between channelsAvoids transformer volt-second offset in bridge
Symmetrical UVLO circuitEnsures high-side and low-side shut down at the same time
TTL optimized thresholds with increased hysteresisComplementary to analog or digital PWM controllers; increased hysteresis offers added noise immunity

In the UCC27212 device, the high side and low side each have independent inputs that allow maximum flexibility of input control signals in the application. The boot diode for the high-side driver bias supply is internal to the UCC27212. The UCC27212 is the TTL or logic compatible version. The high-side driver is referenced to the switch node (HS), which is typically the source pin of the high-side MOSFET and drain pin of the low-side MOSFET. The low-side driver is referenced to VSS, which is typically ground. The UCC27212 functions are divided into the input stages, UVLO protection, level shift, boot diode, and output driver stages.