The useful range of a driver is greatly affected by the drive-power requirements of the load and the thermal characteristics of the package. For a gate driver to be useful over a particular temperature range, the package must allow for efficient removal of the heat produced while keeping the junction temperature within rated limits. The thermal metrics for the driver package are listed in Section 9.2.1. For detailed information regarding the table, refer to the Application Note from Texas Instruments entitled Semiconductor and IC Package Thermal Metrics (SPRA953). The UCC27212 device is offered in SOIC (8) and VSON (8).