SLUSDD4B April   2019  – December 2020

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 UVLO
      2. 7.3.2 Reference
      3. 7.3.3 Totem-Pole Output
    4. 7.4 Device Functional Modes
  8. 8 Application Information Disclaimer
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Switching Frequency
        2. 8.2.2.2 Transformer
        3. 8.2.2.3 RCD Diode Clamp
        4. 8.2.2.4 Output Diode
        5. 8.2.2.5 Output Filter and Capacitor
        6. 8.2.2.6 Compensation
        7. 8.2.2.7 Sense Resistor and Slope Compensation
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Feedback Traces
      2. 10.1.2 Input/Output Capacitors
      3. 10.1.3 Compensation Components
      4. 10.1.4 Traces and Ground Planes
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

4 Revision History

Changes from Revision A (September 2019) to Revision B (December 2020)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Updated Applications sectionGo
  • Updated Device Information table in Description sectionGo
  • "Versioned" RevB to include EM part number in Device Info table. This was approved per the CMS for Rev B but was left off at release in errorGo
  • Added Bare Die Information table to Pin Configuration and Functions sectionGo
  • Added UC1843B-SP Bare Die Pin Locations figure to Pin Configuration and Functions sectionGo
  • Added Bond Pad Coordinates in Microns table to Pin Configuration and Functions sectionGo

Changes from Revision * (April 2019) to Revision A (September 2019)

  • Changed the package image in the Pin Configuration and Functions sectionGo
  • Changed <10 mA To: <17 mA in Figure 7-5 Go
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