SLUUCG7 April   2024 BQ76922

 

  1.   1
  2.   Read This First
    1.     About This Manual
    2.     Battery Notational Conventions
    3.     Trademarks
    4.     Glossary
  3. Introduction
  4. Device Description
    1. 2.1 Overview
    2. 2.2 Functional Block Diagram
  5. Device Configuration
    1. 3.1 Direct Commands and Subcommands
    2. 3.2 Configuration Using OTP or Registers
    3. 3.3 Data Formats
      1. 3.3.1 Unsigned Integer
      2. 3.3.2 Integer
      3. 3.3.3 Floating Point
      4. 3.3.4 Hex
  6. Measurement Subsystem
    1. 4.1  Voltage Measurement
      1. 4.1.1 Voltage Measurement Schedule
      2. 4.1.2 Usage of VC Pins for Cells Versus Interconnect
      3. 4.1.3 Cell Interconnect Resistance
    2. 4.2  General Purpose ADCIN Functionality
    3. 4.3  Coulomb Counter and Digital Filters
    4. 4.4  Synchronized Voltage and Current Measurement
    5. 4.5  Subcommands 0x0071–0x0072 DASTATUS1-2() , Cell Voltage and Synchronized Current Counts
    6. 4.6  Subcommands 0x0075–0x0076 DASTATUS5-6(), Additional Measurements
    7. 4.7  Internal Temperature Measurement
    8. 4.8  Thermistor Temperature Measurement
    9. 4.9  Factory Trim of Voltage ADC
    10. 4.10 Voltage Calibration (ADC Measurements)
    11. 4.11 Voltage Calibration (COV and CUV Protections)
    12. 4.12 Current Calibration
    13. 4.13 Temperature Calibration
  7. Primary and Secondary Protection Subsystems
    1. 5.1 Protections Overview
    2. 5.2 Primary Protections
      1. 5.2.1  Primary Protections Overview
      2. 5.2.2  High-Side NFET Drivers
      3. 5.2.3  Protection FETs Configuration and Control
        1. 5.2.3.1 FET Configuration
        2. 5.2.3.2 FET Control
          1. 5.2.3.2.1 Precharge Mode
          2. 5.2.3.2.2 Predischarge Mode
      4. 5.2.4  Cell Overvoltage Protection
      5. 5.2.5  Cell Undervoltage Protection
      6. 5.2.6  Short Circuit in Discharge Protection
      7. 5.2.7  Overcurrent in Charge Protection
      8. 5.2.8  Overcurrent in Discharge 1, 2, and 3 Protections
      9. 5.2.9  Overtemperature in Charge Protection
      10. 5.2.10 Overtemperature in Discharge Protection
      11. 5.2.11 Overtemperature FET Protection
      12. 5.2.12 Internal Overtemperature Protection
      13. 5.2.13 Undertemperature in Charge Protection
      14. 5.2.14 Undertemperature in Discharge Protection
      15. 5.2.15 Internal Undertemperature Protection
      16. 5.2.16 Host Watchdog Protection
      17. 5.2.17 Precharge Timeout Protection
      18. 5.2.18 Load Detect Functionality
    3. 5.3 Secondary Protections
      1. 5.3.1  Secondary Protections Overview
      2. 5.3.2  Copper Deposition (CUDEP) Permanent Fail
      3. 5.3.3  Safety Undervoltage (SUV) Permanent Fail
      4. 5.3.4  Safety Overvoltage (SOV) Permanent Fail
      5. 5.3.5  Safety Overcurrent in Charge (SOCC) Permanent Fail
      6. 5.3.6  Safety Overcurrent in Discharge (SOCD) Permanent Fail
      7. 5.3.7  Safety Cell Overtemperature (SOT) Permanent Fail
      8. 5.3.8  Safety FET Overtemperature (SOTF) Permanent Fail
      9. 5.3.9  Charge FET (CFETF) Permanent Fail
      10. 5.3.10 Discharge FET (DFETF) Permanent Fail
      11. 5.3.11 Secondary Protector (2LVL) Permanent Fail
      12. 5.3.12 Voltage Imbalance in Relax (VIMR) Permanent Fail
      13. 5.3.13 Voltage Imbalance in Active (VIMA) Permanent Fail
      14. 5.3.14 Short Circuit in Discharge Latched Permanent Fail
      15. 5.3.15 OTP Memory Signature Permanent Fail
      16. 5.3.16 Data ROM Memory Signature Permanent Fail
      17. 5.3.17 Instruction ROM Memory Signature Permanent Fail
      18. 5.3.18 LFO Oscillator Permanent Fail
      19. 5.3.19 Voltage Reference Permanent Fail
      20. 5.3.20 VSS Permanent Fail
      21. 5.3.21 Protection Comparator MUX Permanent Fail
      22. 5.3.22 Commanded Permanent Fail
      23. 5.3.23 Top of Stack Measurement Check
      24. 5.3.24 Cell Open Wire
  8. Device Status and Controls
    1. 6.1 0x00 Control Status() and 0x12 Battery Status() Commands
    2. 6.2 0x0070 MANU_DATA() Subcommand
    3. 6.3 LDOs
      1. 6.3.1 Pre-Regulator Control
      2. 6.3.2 REG1 LDO Control
    4. 6.4 Multifunction Pin Controls
    5. 6.5 CFETOFF, DFETOFF, and BOTHOFF Pin Functionality
    6. 6.6 ALERT Pin Operation
    7. 6.7 Fuse Drive
    8. 6.8 Device Event Timing
  9. Operational Modes
    1. 7.1 Overview
    2. 7.2 NORMAL Mode
    3. 7.3 SLEEP Mode
    4. 7.4 DEEPSLEEP Mode
    5. 7.5 SHUTDOWN Mode
    6. 7.6 CONFIG_UPDATE Mode
  10. Device Security
    1. 8.1 Overview
  11. Serial Communications Interfaces
    1. 9.1 Serial Communications Overview
    2. 9.2 I2C Communications Subsystem
    3. 9.3 HDQ Communications Interface
  12. 10Cell Balancing
    1. 10.1 Cell Balancing Operation
    2. 10.2 Cell Balancing Timing
  13. 11Diagnostics
    1. 11.1 Diagnostics Overview
    2. 11.2 VREF2 Versus VREF1 Check
    3. 11.3 VSS Measurement
    4. 11.4 Top of Stack Measurement Check
    5. 11.5 LFO Oscillator Monitor
    6. 11.6 Protection Comparator Mux Check
    7. 11.7 Internal Watchdog Reset
    8. 11.8 Internal Memory Checks
  14. 12Commands and Subcommands
    1. 12.1 Direct Commands
    2. 12.2 Bitfield Definitions for Direct Commands
      1. 12.2.1  Control Status Register
      2. 12.2.2  Safety Alert A Register
      3. 12.2.3  Safety Status A Register
      4. 12.2.4  Safety Alert B Register
      5. 12.2.5  Safety Status B Register
      6. 12.2.6  Safety Alert C Register
      7. 12.2.7  Safety Status C Register
      8. 12.2.8  PF Alert A Register
      9. 12.2.9  PF Status A Register
      10. 12.2.10 PF Alert B Register
      11. 12.2.11 PF Status B Register
      12. 12.2.12 PF Alert C Register
      13. 12.2.13 PF Status C Register
      14. 12.2.14 PF Alert D Register
      15. 12.2.15 PF Status D Register
      16. 12.2.16 Battery Status Register
      17. 12.2.17 Alarm Status Register
      18. 12.2.18 Alarm Raw Status Register
      19. 12.2.19 Alarm Enable Register
      20. 12.2.20 FET Status Register
    3. 12.3 Command-Only Subcommands
    4. 12.4 Subcommands With Data
    5. 12.5 Bitfield Definitions for Subcommands
      1. 12.5.1 PF Status A Register
      2. 12.5.2 PF Status B Register
      3. 12.5.3 PF Status C Register
      4. 12.5.4 PF Status D Register
      5. 12.5.5 Manufacturing Status Register
      6. 12.5.6 FET Control Register
      7. 12.5.7 REG1 Control Register
      8. 12.5.8 OTP Write Check Result Register
      9. 12.5.9 OTP Write Result Register
  15. 13Data Memory Settings
    1. 13.1 Data Memory Access
    2. 13.2 Calibration
      1. 13.2.1  Calibration:Voltage
        1. 13.2.1.1 Calibration:Voltage:Cell 1 Gain
        2. 13.2.1.2 Calibration:Voltage:Cell 2 Gain
        3. 13.2.1.3 Calibration:Voltage:Cell 3 Gain
        4. 13.2.1.4 Calibration:Voltage:Cell 4 Gain
        5. 13.2.1.5 Calibration:Voltage:Cell 5 Gain
        6. 13.2.1.6 Calibration:Voltage:Pack Gain
        7. 13.2.1.7 Calibration:Voltage:TOS Gain
        8. 13.2.1.8 Calibration:Voltage:LD Gain
        9. 13.2.1.9 Calibration:Voltage:ADC Gain
      2. 13.2.2  Calibration:Current
        1. 13.2.2.1 Calibration:Current:CC Gain
        2. 13.2.2.2 Calibration:Current:Capacity Gain
      3. 13.2.3  Calibration:Vcell Offset
        1. 13.2.3.1 Calibration:Vcell Offset:Vcell Offset
      4. 13.2.4  Calibration:V Divider Offset
        1. 13.2.4.1 Calibration:V Divider Offset:Vdiv Offset
      5. 13.2.5  Calibration:Current Offset
        1. 13.2.5.1 Calibration:Current Offset:Coulomb Counter Offset Samples
        2. 13.2.5.2 Calibration:Current Offset:Board Offset
      6. 13.2.6  Calibration:Temperature
        1. 13.2.6.1 Calibration:Temperature:Internal Temp Offset
        2. 13.2.6.2 Calibration:Temperature:CFETOFF Temp Offset
        3. 13.2.6.3 Calibration:Temperature:DFETOFF Temp Offset
        4. 13.2.6.4 Calibration:Temperature:ALERT Temp Offset
        5. 13.2.6.5 Calibration:Temperature:TS1 Temp Offset
        6. 13.2.6.6 Calibration:Temperature:TS2 Temp Offset
      7. 13.2.7  Calibration:Internal Temp Model
        1. 13.2.7.1 Calibration:Internal Temp Model:Int Gain
        2. 13.2.7.2 Calibration:Internal Temp Model:Int base offset
        3. 13.2.7.3 Calibration:Internal Temp Model:Int Maximum AD
        4. 13.2.7.4 Calibration:Internal Temp Model:Int Maximum Temp
      8. 13.2.8  Calibration:18K Temperature Model
        1. 13.2.8.1  Calibration:18K Temperature Model:Coeff a1
        2. 13.2.8.2  Calibration:18K Temperature Model:Coeff a2
        3. 13.2.8.3  Calibration:18K Temperature Model:Coeff a3
        4. 13.2.8.4  Calibration:18K Temperature Model:Coeff a4
        5. 13.2.8.5  Calibration:18K Temperature Model:Coeff a5
        6. 13.2.8.6  Calibration:18K Temperature Model:Coeff b1
        7. 13.2.8.7  Calibration:18K Temperature Model:Coeff b2
        8. 13.2.8.8  Calibration:18K Temperature Model:Coeff b3
        9. 13.2.8.9  Calibration:18K Temperature Model:Coeff b4
        10. 13.2.8.10 Calibration:18K Temperature Model:Adc0
      9. 13.2.9  Calibration:180K Temperature Model
        1. 13.2.9.1  Calibration:180K Temperature Model:Coeff a1
        2. 13.2.9.2  Calibration:180K Temperature Model:Coeff a2
        3. 13.2.9.3  Calibration:180K Temperature Model:Coeff a3
        4. 13.2.9.4  Calibration:180K Temperature Model:Coeff a4
        5. 13.2.9.5  Calibration:180K Temperature Model:Coeff a5
        6. 13.2.9.6  Calibration:180K Temperature Model:Coeff b1
        7. 13.2.9.7  Calibration:180K Temperature Model:Coeff b2
        8. 13.2.9.8  Calibration:180K Temperature Model:Coeff b3
        9. 13.2.9.9  Calibration:180K Temperature Model:Coeff b4
        10. 13.2.9.10 Calibration:180K Temperature Model:Adc0
      10. 13.2.10 Calibration:Custom Temperature Model
        1. 13.2.10.1  Calibration:Custom Temperature Model:Coeff a1
        2. 13.2.10.2  Calibration:Custom Temperature Model:Coeff a2
        3. 13.2.10.3  Calibration:Custom Temperature Model:Coeff a3
        4. 13.2.10.4  Calibration:Custom Temperature Model:Coeff a4
        5. 13.2.10.5  Calibration:Custom Temperature Model:Coeff a5
        6. 13.2.10.6  Calibration:Custom Temperature Model:Coeff b1
        7. 13.2.10.7  Calibration:Custom Temperature Model:Coeff b2
        8. 13.2.10.8  Calibration:Custom Temperature Model:Coeff b3
        9. 13.2.10.9  Calibration:Custom Temperature Model:Coeff b4
        10. 13.2.10.10 Calibration:Custom Temperature Model:Rc0
        11. 13.2.10.11 Calibration:Custom Temperature Model:Adc0
      11. 13.2.11 Calibration:Current Deadband
        1. 13.2.11.1 Calibration:Current Deadband:Coulomb Counter Deadband
      12. 13.2.12 Calibration:CUV
        1. 13.2.12.1 Calibration:CUV:CUV Threshold Override
      13. 13.2.13 Calibration:COV
        1. 13.2.13.1 Calibration:COV:COV Threshold Override
    3. 13.3 Settings
      1. 13.3.1  Settings:Fuse
        1. 13.3.1.1 Settings:Fuse:Min Blow Fuse Voltage
        2. 13.3.1.2 Settings:Fuse:Fuse Blow Timeout
      2. 13.3.2  Settings:Configuration
        1. 13.3.2.1  Settings:Configuration:Power Config
        2. 13.3.2.2  Settings:Configuration:REG1 Config
        3. 13.3.2.3  Settings:Configuration:REG0 Config
        4. 13.3.2.4  Settings:Configuration:HWD Regulator Options
        5. 13.3.2.5  Settings:Configuration:Comm Type
        6. 13.3.2.6  Settings:Configuration:I2C Address
        7. 13.3.2.7  Settings:Configuration:Comm Idle Time
        8. 13.3.2.8  Settings:Configuration:CFETOFF Pin Config
        9. 13.3.2.9  Settings:Configuration:DFETOFF Pin Config
        10. 13.3.2.10 Settings:Configuration:ALERT Pin Config
        11. 13.3.2.11 Settings:Configuration:TS1 Config
        12. 13.3.2.12 Settings:Configuration:TS2 Config
        13. 13.3.2.13 Settings:Configuration:DA Configuration
        14. 13.3.2.14 Settings:Configuration:Vcell Mode
        15. 13.3.2.15 Settings:Configuration:CC3 Samples
      3. 13.3.3  Settings:Protection
        1. 13.3.3.1  Settings:Protection:Protection Configuration
        2. 13.3.3.2  Settings:Protection:Enabled Protections A
        3. 13.3.3.3  Settings:Protection:Enabled Protections B
        4. 13.3.3.4  Settings:Protection:Enabled Protections C
        5. 13.3.3.5  Settings:Protection:CHG FET Protections A
        6. 13.3.3.6  Settings:Protection:CHG FET Protections B
        7. 13.3.3.7  Settings:Protection:CHG FET Protections C
        8. 13.3.3.8  Settings:Protection:DSG FET Protections A
        9. 13.3.3.9  Settings:Protection:DSG FET Protections B
        10. 13.3.3.10 Settings:Protection:DSG FET Protections C
        11. 13.3.3.11 Settings:Protection:Body Diode Threshold
      4. 13.3.4  Settings:Alarm
        1. 13.3.4.1 Settings:Alarm:Default Alarm Mask
        2. 13.3.4.2 Settings:Alarm:SF Alert Mask A
        3. 13.3.4.3 Settings:Alarm:SF Alert Mask B
        4. 13.3.4.4 Settings:Alarm:SF Alert Mask C
        5. 13.3.4.5 Settings:Alarm:PF Alert Mask A
        6. 13.3.4.6 Settings:Alarm:PF Alert Mask B
        7. 13.3.4.7 Settings:Alarm:PF Alert Mask C
        8. 13.3.4.8 Settings:Alarm:PF Alert Mask D
      5. 13.3.5  Settings:Permanent Failure
        1. 13.3.5.1 Settings:Permanent Failure:Enabled PF A
        2. 13.3.5.2 Settings:Permanent Failure:Enabled PF B
        3. 13.3.5.3 Settings:Permanent Failure:Enabled PF C
        4. 13.3.5.4 Settings:Permanent Failure:Enabled PF D
      6. 13.3.6  Settings:FET
        1. 13.3.6.1 Settings:FET:FET Options
        2. 13.3.6.2 Settings:FET:Chg Pump Control
        3. 13.3.6.3 Settings:FET:Precharge Start Voltage
        4. 13.3.6.4 Settings:FET:Precharge Stop Voltage
        5. 13.3.6.5 Settings:FET:Predischarge Timeout
        6. 13.3.6.6 Settings:FET:Predischarge Stop Delta
      7. 13.3.7  Settings:Current Thresholds
        1. 13.3.7.1 Settings:Current Thresholds:Dsg Current Threshold
        2. 13.3.7.2 Settings:Current Thresholds:Chg Current Threshold
      8. 13.3.8  Settings:Cell Open-Wire
        1. 13.3.8.1 Settings:Cell Open-Wire:Check Time
      9. 13.3.9  Settings:Interconnect Resistances
        1. 13.3.9.1 Settings:Interconnect Resistances:Cell 1 Interconnect
        2. 13.3.9.2 Settings:Interconnect Resistances:Cell 2 Interconnect
        3. 13.3.9.3 Settings:Interconnect Resistances:Cell 3 Interconnect
        4. 13.3.9.4 Settings:Interconnect Resistances:Cell 4 Interconnect
        5. 13.3.9.5 Settings:Interconnect Resistances:Cell 5 Interconnect
      10. 13.3.10 Settings:Manufacturing
        1. 13.3.10.1 Settings:Manufacturing:Mfg Status Init
      11. 13.3.11 Settings:Cell Balancing Config
        1. 13.3.11.1  Settings:Cell Balancing Config:Balancing Configuration
        2. 13.3.11.2  Settings:Cell Balancing Config:Min Cell Temp
        3. 13.3.11.3  Settings:Cell Balancing Config:Max Cell Temp
        4. 13.3.11.4  Settings:Cell Balancing Config:Max Internal Temp
        5. 13.3.11.5  Settings:Cell Balancing Config:Cell Balance Interval
        6. 13.3.11.6  Settings:Cell Balancing Config:Cell Balance Max Cells
        7. 13.3.11.7  Settings:Cell Balancing Config:Cell Balance Min Cell V (Charge)
        8. 13.3.11.8  Settings:Cell Balancing Config:Cell Balance Min Delta (Charge)
        9. 13.3.11.9  Settings:Cell Balancing Config:Cell Balance Stop Delta (Charge)
        10. 13.3.11.10 Settings:Cell Balancing Config:Cell Balance Min Cell V (Relax)
        11. 13.3.11.11 Settings:Cell Balancing Config:Cell Balance Min Delta (Relax)
        12. 13.3.11.12 Settings:Cell Balancing Config:Cell Balance Stop Delta (Relax)
    4. 13.4 Power
      1. 13.4.1 Power:Shutdown
        1. 13.4.1.1 Power:Shutdown:Shutdown Cell Voltage
        2. 13.4.1.2 Power:Shutdown:Shutdown Stack Voltage
        3. 13.4.1.3 Power:Shutdown:Low V Shutdown Delay
        4. 13.4.1.4 Power:Shutdown:Shutdown Temperature
        5. 13.4.1.5 Power:Shutdown:Shutdown Temperature Delay
        6. 13.4.1.6 Power:Shutdown:FET Off Delay
        7. 13.4.1.7 Power:Shutdown:Shutdown Command Delay
        8. 13.4.1.8 Power:Shutdown:Auto Shutdown Time
        9. 13.4.1.9 Power:Shutdown:RAM Fail Shutdown Time
      2. 13.4.2 Power:Sleep
        1. 13.4.2.1 Power:Sleep:Sleep Current
        2. 13.4.2.2 Power:Sleep:Voltage Time
        3. 13.4.2.3 Power:Sleep:Wake Comparator Current
        4. 13.4.2.4 Power:Sleep:Sleep Hysteresis Time
        5. 13.4.2.5 Power:Sleep:Sleep Charger Voltage Threshold
        6. 13.4.2.6 Power:Sleep:Sleep Charger PACK-TOS Delta
    5. 13.5 System Data
      1. 13.5.1 System Data:Integrity
        1. 13.5.1.1 System Data:Integrity:Config RAM Signature
    6. 13.6 Protections
      1. 13.6.1  Protections:CUV
        1. 13.6.1.1 Protections:CUV:Threshold
        2. 13.6.1.2 Protections:CUV:Delay
        3. 13.6.1.3 Protections:CUV:Recovery Hysteresis
      2. 13.6.2  Protections:COV
        1. 13.6.2.1 Protections:COV:Threshold
        2. 13.6.2.2 Protections:COV:Delay
        3. 13.6.2.3 Protections:COV:Recovery Hysteresis
      3. 13.6.3  Protections:COVL
        1. 13.6.3.1 Protections:COVL:Latch Limit
        2. 13.6.3.2 Protections:COVL:Counter Dec Delay
        3. 13.6.3.3 Protections:COVL:Recovery Time
      4. 13.6.4  Protections:OCC
        1. 13.6.4.1 Protections:OCC:Threshold
        2. 13.6.4.2 Protections:OCC:Delay
        3. 13.6.4.3 Protections:OCC:Recovery Threshold
        4. 13.6.4.4 Protections:OCC:PACK-TOS Delta
      5. 13.6.5  Protections:OCD1
        1. 13.6.5.1 Protections:OCD1:Threshold
        2. 13.6.5.2 Protections:OCD1:Delay
      6. 13.6.6  Protections:OCD2
        1. 13.6.6.1 Protections:OCD2:Threshold
        2. 13.6.6.2 Protections:OCD2:Delay
      7. 13.6.7  Protections:SCD
        1. 13.6.7.1 Protections:SCD:Threshold
        2. 13.6.7.2 Protections:SCD:Delay
        3. 13.6.7.3 Protections:SCD:Recovery Time
      8. 13.6.8  Protections:OCD3
        1. 13.6.8.1 Protections:OCD3:Threshold
        2. 13.6.8.2 Protections:OCD3:Delay
      9. 13.6.9  Protections:OCD
        1. 13.6.9.1 Protections:OCD:Recovery Threshold
      10. 13.6.10 Protections:OCDL
        1. 13.6.10.1 Protections:OCDL:Latch Limit
        2. 13.6.10.2 Protections:OCDL:Counter Dec Delay
        3. 13.6.10.3 Protections:OCDL:Recovery Time
        4. 13.6.10.4 Protections:OCDL:Recovery Threshold
      11. 13.6.11 Protections:SCDL
        1. 13.6.11.1 Protections:SCDL:Latch Limit
        2. 13.6.11.2 Protections:SCDL:Counter Dec Delay
        3. 13.6.11.3 Protections:SCDL:Recovery Time
        4. 13.6.11.4 Protections:SCDL:Recovery Threshold
      12. 13.6.12 Protections:OTC
        1. 13.6.12.1 Protections:OTC:Threshold
        2. 13.6.12.2 Protections:OTC:Delay
        3. 13.6.12.3 Protections:OTC:Recovery
      13. 13.6.13 Protections:OTD
        1. 13.6.13.1 Protections:OTD:Threshold
        2. 13.6.13.2 Protections:OTD:Delay
        3. 13.6.13.3 Protections:OTD:Recovery
      14. 13.6.14 Protections:OTF
        1. 13.6.14.1 Protections:OTF:Threshold
        2. 13.6.14.2 Protections:OTF:Delay
        3. 13.6.14.3 Protections:OTF:Recovery
      15. 13.6.15 Protections:OTINT
        1. 13.6.15.1 Protections:OTINT:Threshold
        2. 13.6.15.2 Protections:OTINT:Delay
        3. 13.6.15.3 Protections:OTINT:Recovery
      16. 13.6.16 Protections:UTC
        1. 13.6.16.1 Protections:UTC:Threshold
        2. 13.6.16.2 Protections:UTC:Delay
        3. 13.6.16.3 Protections:UTC:Recovery
      17. 13.6.17 Protections:UTD
        1. 13.6.17.1 Protections:UTD:Threshold
        2. 13.6.17.2 Protections:UTD:Delay
        3. 13.6.17.3 Protections:UTD:Recovery
      18. 13.6.18 Protections:UTINT
        1. 13.6.18.1 Protections:UTINT:Threshold
        2. 13.6.18.2 Protections:UTINT:Delay
        3. 13.6.18.3 Protections:UTINT:Recovery
      19. 13.6.19 Protections:Recovery
        1. 13.6.19.1 Protections:Recovery:Time
      20. 13.6.20 Protections:HWD
        1. 13.6.20.1 Protections:HWD:Delay
      21. 13.6.21 Protections:Load Detect
        1. 13.6.21.1 Protections:Load Detect:Active Time
        2. 13.6.21.2 Protections:Load Detect:Retry Delay
        3. 13.6.21.3 Protections:Load Detect:Timeout
      22. 13.6.22 Protections:PTO
        1. 13.6.22.1 Protections:PTO:Charge Threshold
        2. 13.6.22.2 Protections:PTO:Delay
        3. 13.6.22.3 Protections:PTO:Reset
    7. 13.7 Permanent Fail
      1. 13.7.1  Permanent Fail:CUDEP
        1. 13.7.1.1 Permanent Fail:CUDEP:Threshold
        2. 13.7.1.2 Permanent Fail:CUDEP:Delay
      2. 13.7.2  Permanent Fail:SUV
        1. 13.7.2.1 Permanent Fail:SUV:Threshold
        2. 13.7.2.2 Permanent Fail:SUV:Delay
      3. 13.7.3  Permanent Fail:SOV
        1. 13.7.3.1 Permanent Fail:SOV:Threshold
        2. 13.7.3.2 Permanent Fail:SOV:Delay
      4. 13.7.4  Permanent Fail:TOS
        1. 13.7.4.1 Permanent Fail:TOS:Threshold
        2. 13.7.4.2 Permanent Fail:TOS:Delay
      5. 13.7.5  Permanent Fail:SOCC
        1. 13.7.5.1 Permanent Fail:SOCC:Threshold
        2. 13.7.5.2 Permanent Fail:SOCC:Delay
      6. 13.7.6  Permanent Fail:SOCD
        1. 13.7.6.1 Permanent Fail:SOCD:Threshold
        2. 13.7.6.2 Permanent Fail:SOCD:Delay
      7. 13.7.7  Permanent Fail:SOT
        1. 13.7.7.1 Permanent Fail:SOT:Threshold
        2. 13.7.7.2 Permanent Fail:SOT:Delay
      8. 13.7.8  Permanent Fail:SOTF
        1. 13.7.8.1 Permanent Fail:SOTF:Threshold
        2. 13.7.8.2 Permanent Fail:SOTF:Delay
      9. 13.7.9  Permanent Fail:VIMR
        1. 13.7.9.1 Permanent Fail:VIMR:Check Voltage
        2. 13.7.9.2 Permanent Fail:VIMR:Max Relax Current
        3. 13.7.9.3 Permanent Fail:VIMR:Threshold
        4. 13.7.9.4 Permanent Fail:VIMR:Delay
        5. 13.7.9.5 Permanent Fail:VIMR:Relax Min Duration
      10. 13.7.10 Permanent Fail:VIMA
        1. 13.7.10.1 Permanent Fail:VIMA:Check Voltage
        2. 13.7.10.2 Permanent Fail:VIMA:Min Active Current
        3. 13.7.10.3 Permanent Fail:VIMA:Threshold
        4. 13.7.10.4 Permanent Fail:VIMA:Delay
      11. 13.7.11 Permanent Fail:CFETF
        1. 13.7.11.1 Permanent Fail:CFETF:OFF Threshold
        2. 13.7.11.2 Permanent Fail:CFETF:OFF Delay
      12. 13.7.12 Permanent Fail:DFETF
        1. 13.7.12.1 Permanent Fail:DFETF:OFF Threshold
        2. 13.7.12.2 Permanent Fail:DFETF:OFF Delay
      13. 13.7.13 Permanent Fail:VSSF
        1. 13.7.13.1 Permanent Fail:VSSF:Fail Threshold
        2. 13.7.13.2 Permanent Fail:VSSF:Delay
      14. 13.7.14 Permanent Fail:2LVL
        1. 13.7.14.1 Permanent Fail:2LVL:Delay
      15. 13.7.15 Permanent Fail:LFOF
        1. 13.7.15.1 Permanent Fail:LFOF:Delay
      16. 13.7.16 Permanent Fail:HWMX
        1. 13.7.16.1 Permanent Fail:HWMX:Delay
    8. 13.8 Security
      1. 13.8.1 Security:Settings
        1. 13.8.1.1 Security:Settings:Security Settings
      2. 13.8.2 Security:Keys
        1. 13.8.2.1 Security:Keys:Unseal Key Step 1
        2. 13.8.2.2 Security:Keys:Unseal Key Step 2
        3. 13.8.2.3 Security:Keys:Full Access Key Step 1
        4. 13.8.2.4 Security:Keys:Full Access Key Step 2
    9. 13.9 Data Memory Summary
  16. 14Revision History

SHUTDOWN Mode

SHUTDOWN mode is the lowest power mode of the BQ76922, which can be used for shipping or long-term storage. In this mode, the device loses all register state information, the internal logic is powered down, the protection FETs are all disabled, so no voltage is provided at the battery pack terminals. All protections are disabled, all voltage, current, and temperature measurements are disabled, and no communications are supported. When the device exits SHUTDOWN, it will boot and read parameters stored in OTP (if that has been written). If the OTP has not been written, the device will power up with default settings, and then settings can be changed by the host writing device registers.

Entering SHUTDOWN mode involves a sequence of steps. The sequence can be initiated manually by sending the 0x0010 SHUTDOWN() subcommand twice in a row within a 4-s time window if the device is SEALED. The subcommand is only required to be sent once if in UNSEALED or FULLACCESS modes. If this subcommand is sent twice in a row while the device is in UNSEALED or in FULLACCESS modes, the delays associated with the sequence are skipped. The device can also be configured to enter SHUTDOWN mode automatically based on the top of stack voltage or the minimum cell voltage. If the top-of-stack voltage falls below Power:Shutdown:Shutdown Stack Voltage or if the minimum cell voltage falls below Power:Shutdown:Shutdown Cell Voltage, the SHUTDOWN mode sequence is automatically initiated. The shutdown based on cell voltage does not apply to cell input pins being used to measure interconnect, based on settings in Settings:Configuration:Vcell mode.

Note: If this feature is enabled and cell open-wire detection is also enabled, an open-wire condition may result in the device entering SHUTDOWN mode before an open-wire fault can be recorded unless delays are set appropriately. If an automatic shutdown has been started based on the cell or stack voltage, and the voltage measured on the PACK pin is equal or above the top-of-stack (TOS) voltage by a threshold given by Power:Sleep:Sleep Charger PACK-TOS Delta, the device will return to NORMAL mode, which allows the pack to be charged out of a low voltage condition.

While the BQ76922 device is in NORMAL mode or SLEEP mode, the device can also be configured to enter SHUTDOWN mode if the internal temperature measurement exceeds Power:Shutdown:Shutdown Temperature for Power:Shutdown:Shutdown Temperature Delay seconds.

When the SHUTDOWN mode sequence has been initiated by the 0x0010 SHUTDOWN() subcommand or the RST_SHUT pin driven high for 1 second, the device will wait for Power:Shutdown:FET Off Delay then disable the protection FETs. After a delay of Power:Shutdown:Shutdown Command Delay from when the sequence begins, the device will enter SHUTDOWN mode (so Power:Shutdown:Shutdown Command Delay should be set longer than Power:Shutdown:FET Off Delay). However, if the voltage on the LD pin is still above the VWAKEONLD level, shutdown will be delayed until the voltage on LD falls below that level.

Note: When SHUTDOWN mode is initiated in this manner, the device will first transition to NORMAL mode and will block entrance to SLEEP mode. If the FETs were initially off (such as if the device was in DEEPSLEEP mode) and Power:Shutdown:FET Off Delay = 0, the FETs will remain off. However, if Power:Shutdown:FET Off Delay > 0, the FETs may be enabled (if not blocked) upon entering NORMAL mode, then disabled after the Power:Shutdown:FET Off Delay. If this is not preferred, the host can send the 0x0095 ALL_FETS_OFF() before entering DEEPSLEEP mode, then can send the 0x0096 ALL_FETS_ON() when exiting DEEPSLEEP mode.

While the device is in SHUTDOWN mode, a ≈5 voltage is provided at the TS2 pin with high source impedance. If the TS2 pin is pulled below VWAKEONTS2, such as by a switch to VSS, or if a voltage is applied at the LD pin above VWAKEONLD (such as when a charger is attached in series FET configuration), the device will exit SHUTDOWN mode. Note: if a thermistor is attached from the TS2 pin to VSS, this will prevent the device from ever fully entering SHUTDOWN mode.

To avoid an unintentional wake from SHUTDOWN mode when putting the BQ76922 device into long-term storage, the device can be configured to automatically reenter SHUTDOWN mode after Power:Shutdown:Auto Shutdown Time minutes if the device boots from SHUTDOWN mode without any valid communications occurring or any charge or discharge current is detected. This feature is disabled by default, so it is necessary to program it enabled in OTP to ensure it is enabled when an unintentional wake occurs. It also does not take effect after a watchdog reset has occurred. See Power:Shutdown:Auto Shutdown Time for more details.

The BQ76922 device performs periodic memory integrity checks and will force a watchdog reset if any corruption is detected. To avoid a cycle of resets in the case of a memory fault, the device will enter SHUTDOWN mode rather than resetting if a memory error is detected within Power:Shutdown:RAM Fail Shutdown Time seconds after a watchdog reset has occurred.

When the device is wakened from SHUTDOWN, it requires approximately 200ms–300ms (if Settings:Permanent Failure:Enabled PF A[CUDEP] is not enabled) for the internal circuitry to power up, load settings from OTP memory, perform initial measurements, evaluate those relative to enabled protections, then to enable FETs if conditions allow. This can be much longer if [CUDEP] is enabled, depending on its associated delay setting in Permanent Fail:CUDEP:Delay.

The BQ76922 device integrates a hardware overtemperature detection circuit, which determines when the die temperature passes an excessive temperature of approximately 120°C. If this detector triggers, the device will automatically begin the sequence to enter SHUTDOWN if the Settings:Configuration:Power Config[OTSD] configuration bit is set.

If the shutdown sequence has been initiated, but the TS2 pin is held below VWAKEONTS2, or the voltage at the LD pin is above VWAKEONLD, then the device will stay in a "soft shutdown" state until the TS2 pin voltage is no longer below VWAKEONTS2, and the LD pin voltage is below VWAKEONLD. While in "soft shutdown," FETs are disabled, protections and measurements are stopped, and serial communication is disabled. The device will exit "soft shutdown" if the LD voltage was allowed to first fall below VWAKEONLD, then was raised above VWAKEONLD by a charger being attached, if the RST_SHUT pin is transitioned from low to high, or the conditions allow the device to continue into SHUTDOWN mode.