SLUUCJ0 November   2023 BQ76907

 

  1.   1
  2.   Read This First
    1.     About This Manual
    2.     Battery Notational Conventions
    3.     Trademarks
    4.     Glossary
  3. 1 Introduction
  4. 2 Device Description
    1. 2.1 Overview
    2. 2.2 Functional Block Diagram
  5. 3 Device Configuration
    1. 3.1 Direct Commands and Subcommands
    2. 3.2 Configuration Using OTP or Registers
    3. 3.3 Data Formats
      1. 3.3.1 Unsigned Integer
      2. 3.3.2 Integer
      3. 3.3.3 Hex
  6. 4 Device Security
  7. 5 Measurement Subsystem
    1. 5.1 Voltage Measurement
      1. 5.1.1 Voltage Measurement Schedule
      2. 5.1.2 Unused VC Cell Input Pins
      3. 5.1.3 General Purpose ADCIN Functionality
    2. 5.2 Coulomb Counter and Digital Filters
    3. 5.3 Internal Temperature Measurement
    4. 5.4 Thermistor Temperature Measurement
    5. 5.5 Measurement Calibration
  8. 6 Protection Subsystem
    1. 6.1  Protections Overview
    2. 6.2  Protection FET Drivers
    3. 6.3  Cell Overvoltage Protection
    4. 6.4  Cell Undervoltage Protection
    5. 6.5  Short Circuit in Discharge Protection
    6. 6.6  Overcurrent in Charge Protection
    7. 6.7  Overcurrent in Discharge 1 and 2 Protections
    8. 6.8  Current Protection Latch
    9. 6.9  CHG Detector
    10. 6.10 Overtemperature in Charge Protection
    11. 6.11 Overtemperature in Discharge Protection
    12. 6.12 Internal Overtemperature Protection
    13. 6.13 Undertemperature in Charge Protection
    14. 6.14 Undertemperature in Discharge Protection
    15. 6.15 Host Watchdog Protection
    16. 6.16 Cell Open Wire Detection
    17. 6.17 Voltage Reference Measurement Diagnostic Protection
    18. 6.18 VSS Measurement Diagnostic Protection
    19. 6.19 REGOUT Diagnostic Protection
    20. 6.20 LFO Oscillator Integrity Diagnostic Protection
    21. 6.21 Internal Factory Trim Diagnostic Protection
  9. 7 Device Status and Controls
    1. 7.1 0x00 Control Status() and 0x12 Battery Status() Commands
    2. 7.2 LDOs
    3. 7.3 ALERT Pin Operation
    4. 7.4 TS Pin Operation
    5. 7.5 Programmable Timer
    6. 7.6 Device Event Timing
  10. 8 Operational Modes
    1. 8.1 Overview of Operational Modes
    2. 8.2 NORMAL Mode
    3. 8.3 SLEEP Mode
    4. 8.4 DEEPSLEEP Mode
    5. 8.5 SHUTDOWN Mode
    6. 8.6 CONFIG_UPDATE Mode
  11. 9 I2C Serial Communications
    1. 9.1 I2C Serial Communications Interface
  12. 10Cell Balancing
    1. 10.1 Cell Balancing
  13. 11Commands and Subcommands
    1. 11.1 Direct Commands
    2. 11.2 Bit field Definitions for Direct Commands
      1. 11.2.1  Safety Alert A Register
      2. 11.2.2  Safety Status A Register
      3. 11.2.3  Safety Alert B Register
      4. 11.2.4  Safety Status B Register
      5. 11.2.5  Battery Status Register
      6. 11.2.6  Alarm Status Register
      7. 11.2.7  Alarm Raw Status Register
      8. 11.2.8  Alarm Enable Register
      9. 11.2.9  FET CONTROL Register
      10. 11.2.10 REGOUT CONTROL Register
      11. 11.2.11 DSG FET Driver PWM Control Register
      12. 11.2.12 CHG FET Driver PWM Control Register
    3. 11.3 Command-only Subcommands
    4. 11.4 Subcommands with Data
    5. 11.5 Bit field Definitions for Subcommands
      1. 11.5.1 DEVICE NUMBER Register
      2. 11.5.2 FW VERSION Register
      3. 11.5.3 HW VERSION Register
      4. 11.5.4 SECURITY KEYS Register
      5. 11.5.5 CB ACTIVE CELLS Register
      6. 11.5.6 PROG TIMER Register
      7. 11.5.7 PROT RECOVERY Register
  14. 12Data Memory
    1. 12.1 Calibration
      1. 12.1.1 Calibration:Voltage
        1. 12.1.1.1 Calibration:Voltage:Cell 1 Gain
        2. 12.1.1.2 Calibration:Voltage:Cell 2 Gain Delta
        3. 12.1.1.3 Calibration:Voltage:Cell 3 Gain Delta
        4. 12.1.1.4 Calibration:Voltage:Cell 4 and 5 Gain Delta
        5. 12.1.1.5 Calibration:Voltage:Cell 6 and 7 Gain Delta
        6. 12.1.1.6 Calibration:Voltage:Stack Gain
      2. 12.1.2 Calibration:Current
        1. 12.1.2.1 Calibration:Current:Curr Gain
        2. 12.1.2.2 Calibration:Current:Curr Offset
        3. 12.1.2.3 Calibration:Current:CC1 Gain
        4. 12.1.2.4 Calibration:Current:CC1 Offset
      3. 12.1.3 Calibration:Temperature
        1. 12.1.3.1 Calibration:Temperature:TS Offset
        2. 12.1.3.2 Calibration:Temperature:Int Temp Gain
        3. 12.1.3.3 Calibration:Temperature:Int Temp Offset
    2. 12.2 Settings
      1. 12.2.1 Settings:Configuration
        1. 12.2.1.1 Settings:Configuration:Power Config
        2. 12.2.1.2 Settings:Configuration:REGOUT Config
        3. 12.2.1.3 Settings:Configuration:I2C Address
        4. 12.2.1.4 Settings:Configuration:I2C Config
        5. 12.2.1.5 Settings:Configuration:DA Config
        6. 12.2.1.6 Settings:Configuration:Vcell Mode
        7. 12.2.1.7 Settings:Configuration:Default Alarm Mask
        8. 12.2.1.8 Settings:Configuration:FET Options
        9. 12.2.1.9 Settings:Configuration:Charge Detector Time
      2. 12.2.2 Settings:Cell Balancing
        1. 12.2.2.1 Settings:Cell Balancing:Balancing Configuration
        2. 12.2.2.2 Settings:Cell Balancing:Min Temp Threshold
        3. 12.2.2.3 Settings:Cell Balancing:Max Temp Threshold
        4. 12.2.2.4 Settings:Cell Balancing:Max Internal Temp
      3. 12.2.3 Settings:Protection
        1. 12.2.3.1 Settings:Protection:Enabled Protections A
        2. 12.2.3.2 Settings:Protection:Enabled Protections B
        3. 12.2.3.3 Settings:Protection:DSG FET Protections A
        4. 12.2.3.4 Settings:Protection:CHG FET Protections A
        5. 12.2.3.5 Settings:Protection:Both FET Protections B
        6. 12.2.3.6 Settings:Protection:Body Diode Threshold
        7. 12.2.3.7 Settings:Protection:Cell Open Wire NORMAL Check Time
        8. 12.2.3.8 Settings:Protection:Cell Open Wire SLEEP Check Time
        9. 12.2.3.9 Settings:Protection:Host Watchdog Timeout
    3. 12.3 Protections
      1. 12.3.1 Protections:Cell Voltage
        1. 12.3.1.1 Protections:Cell Voltage:Cell Undervoltage Protection Threshold
        2. 12.3.1.2 Protections:Cell Voltage:Cell Undervoltage Protection Delay
        3. 12.3.1.3 Protections:Cell Voltage:Cell Undervoltage Protection Recovery Hysteresis
        4. 12.3.1.4 Protections:Cell Voltage:Cell Overvoltage Protection Threshold
        5. 12.3.1.5 Protections:Cell Voltage:Cell Overvoltage Protection Delay
        6. 12.3.1.6 Protections:Cell Voltage:Cell Overvoltage Protection Recovery Hysteresis
      2. 12.3.2 Protections:Current
        1. 12.3.2.1  Protections:Current:Overcurrent in Charge Protection Threshold
        2. 12.3.2.2  Protections:Current:Overcurrent in Charge Protection Delay
        3. 12.3.2.3  Protections:Current:Overcurrent in Discharge 1 Protection Threshold
        4. 12.3.2.4  Protections:Current:Overcurrent in Discharge 1 Protection Delay
        5. 12.3.2.5  Protections:Current:Overcurrent in Discharge 2 Protection Threshold
        6. 12.3.2.6  Protections:Current:Overcurrent in Discharge 2 Protection Delay
        7. 12.3.2.7  Protections:Current:Short Circuit in Discharge Protection Threshold
        8. 12.3.2.8  Protections:Current:Short Circuit in Discharge Protection Delay
        9. 12.3.2.9  Protections:Current:Latch Limit
        10. 12.3.2.10 Protections:Current:Recovery Time
      3. 12.3.3 Protections:Temperature
        1. 12.3.3.1  Protections:Temperature:Overtemperature in Charge Protection Threshold
        2. 12.3.3.2  Protections:Temperature:Overtemperature in Charge Protection Delay
        3. 12.3.3.3  Protections:Temperature:Overtemperature in Charge Protection Recovery
        4. 12.3.3.4  Protections:Temperature:Undertemperature in Charge Protection Threshold
        5. 12.3.3.5  Protections:Temperature:Undertemperature in Charge Protection Delay
        6. 12.3.3.6  Protections:Temperature:Undertemperature in Charge Protection Recovery
        7. 12.3.3.7  Protections:Temperature:Overtemperature in Discharge Protection Threshold
        8. 12.3.3.8  Protections:Temperature:Overtemperature in Discharge Protection Delay
        9. 12.3.3.9  Protections:Temperature:Overtemperature in Discharge Protection Recovery
        10. 12.3.3.10 Protections:Temperature:Undertemperature in Discharge Protection Threshold
        11. 12.3.3.11 Protections:Temperature:Undertemperature in Discharge Protection Delay
        12. 12.3.3.12 Protections:Temperature:Undertemperature in Discharge Protection Recovery
        13. 12.3.3.13 Protections:Temperature:Internal Overtemperature Protection Threshold
        14. 12.3.3.14 Protections:Temperature:Internal Overtemperature Protection Delay
        15. 12.3.3.15 Protections:Temperature:Internal Overtemperature Protection Recovery
    4. 12.4 Power
      1. 12.4.1 Power:Sleep
        1. 12.4.1.1 Power:Sleep:Sleep Current
        2. 12.4.1.2 Power:Sleep:Voltage Time
        3. 12.4.1.3 Power:Sleep:Wake Comparator Current
      2. 12.4.2 Power:Shutdown
        1. 12.4.2.1 Power:Shutdown:Shutdown Cell Voltage
        2. 12.4.2.2 Power:Shutdown:Shutdown Stack Voltage
        3. 12.4.2.3 Power:Shutdown:Shutdown Temperature
        4. 12.4.2.4 Power:Shutdown:Auto Shutdown Time
    5. 12.5 Security
      1. 12.5.1 Security:Settings
        1. 12.5.1.1 Security:Settings:Security Settings
        2. 12.5.1.2 Security:Settings:Full Access Key Step 1
        3. 12.5.1.3 Security:Settings:Full Access Key Step 2
    6. 12.6 Data Memory Summary
  15. 13Revision History

12.2.1.5 Settings:Configuration:DA Config

Class Subclass Name Type Min Max Default Unit
Settings Configuration DA Config H2 0x0000 0xFFFF 0x0000 Hex
15 14 13 12 11 10 9 8
RSVD0_6 RSVD0_5 RSVD0_4 RSVD0_3 RSVD0_2 RSVD0_1 RSVD0_0 TSMODE
7 6 5 4 3 2 1 0
CCMODE_1 CCMODE_0 CVADCSPEED_1 CVADCSPEED_0 IADCSPEED_1 IADCSPEED_0 SSADCSPEED_1 SSADCSPEED_0

Description: This register includes configuration settings related to the device data acquisition

Table 12-5 DA Config Register Field Descriptions
Bit Field Default Description
8 TSMODE 0 This bit controls whether the TS pin is used for external thermistor measurement or as a general purpose ADC input.

0 = TS pin is used for external thermistor measurement, with the internal pullup resistor enabled during measurement, and the ADC used in ratiometric mode, using the internal REG18 LDO voltage for the pullup resistor bias and for the ADC reference.

1 = TS pin is used for general purpose ADC voltage measurement, with the internal pullup resistor disabled during measurement, and the ADC using the internal bandgap for its reference.
7–6 CCMODE_1–CCMODE_0 0 Selects coulomb counter mode. Note that CC1 Current() and accumulated charge integration only operates in modes where the coulomb counter is running continuously (0x00 NORMAL mode, or 0x01 NORMAL mode while no idle slots are being introduced, or 0x02 NORMAL mode)

0 = NORMAL mode: Coulomb counter runs continuously, independent of the LOOP_SLOW or CB_LOOP_SLOW setting. SLEEP mode: Coulomb counter run continuously while the voltage ADC is running in SLEEP mode during a burst measurement. It stops at the conclusion of the measurement underway when the burst measurement completes. Startup mode (at initial powerup from SHUTDOWN or exit of DEEPSLEEP): Coulomb counter runs continuously while the voltage ADC is running during the Startup Sequence. It stops at the conclusion of the measurement underway when the Startup Sequence completes (default)

1 = NORMAL mode: Coulomb counter runs continuously if LOOP_SLOW or CB_LOOP_SLOW is set to the fastest setting. When these parameters are modified to slower settings, the device inserts 1, 3, or 7 idle slots between each current measurement slot, thereby reducing the average output rate of the current measurements. SLEEP mode: Coulomb counter run continuously while the voltage ADC is running in SLEEP mode during a burst measurement. It stops at the conclusion of the measurement underway when the burst measurement completes. Startup mode (at initial powerup from SHUTDOWN or exit of DEEPSLEEP): Coulomb counter runs continuously while the voltage ADC is running during the Startup Sequence. It stops at the conclusion of the measurement underway when the Startup Sequence completes.

2 = NORMAL mode: Coulomb counter runs continuously in low power mode (so only takes approximately 4 µA instead of approximately 60 µA).SLEEP mode: SLEEP mode: Coulomb counter takes one measurement at the beginning of each burst measurement using its low power mode. Startup mode (at initial powerup from SHUTDOWN or exit of DEEPSLEEP): Coulomb counter takes one measurement using its low power mode at the beginning of the Startup Sequence.

3 = Coulomb counter is powered down and does not operate at all. This provides a low power mode for customers who do not need current measurement.
5–4 CVADCSPEED_1–CVADCSPEED_0 0 Selects ADC conversion speed for cell voltage measurements. Higher speed results in higher noise in conversions.

0 = 2.93 ms per conversion (default)

1 = 1.46 ms per conversion

2 = 732 µs per conversion

3 = 366 µs per conversion
3–2 IADCSPEED_1–IADCSPEED_0 0 Selects ADC conversion speed for current measurements. Higher speed results in higher noise in conversions.

0 = 2.93 ms per conversion (default)

1 = 1.46 ms per conversion

2 = 732 µs per conversion

3 = 366 µs per conversion
1–0 SSADCSPEED_1–SSADCSPEED_0 0 Selects ADC conversion speed for Shared Slot measurements. Higher speed results in higher noise in conversions.

0 = 2.93 ms per conversion (default)

1 = 1.46 ms per conversion

2 = 732 µs per conversion

3 = 366 µs per conversion
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