SLVAEB1A
March 2020 – October 2021
TLV62568
,
TLV62569
,
TLV62585
Trademarks
1
Introduction
2
Describing the TLV62569 Package Technologies: SOT23-5, SOT23-6, and SOT563
3
Understanding Thermal Performance and Junction Temperature Estimation
3.1
Understanding Thermal Performance
3.2
Estimating Junction Temperature
4
Measurement Setup and Test Results
4.1
Efficiency Measurements
4.2
Thermal Measurements
5
Thermal Performance Analysis for SOT23-5, SOT23-6, and SOT563 Packages
5.1
Comparing SOT563 (DRL) and SOT23-6 (DDC)
5.2
Comparing SOT23-6 (DDC) and SOT23-5 (DBV)
5.3
Comparing SOT563 (DRL) and SOT23-5 (DBV)
6
Summary
7
References
8
Revision History
7
References
Texas Instruments,
Semiconductor and IC Package Thermal Metrics
application report.
Texas Instruments,
SOT23 Package Thermal Consideration
application report.
Texas Instruments,
How To Use Psi Jt User Guide
.
Texas Instruments,
TI's Journey to High-volume Copper Wire Bonding Production
white paper.
Texas Instruments,
TLV62569 2-A High Efficiency Synchronous Buck Converter in SOT Package
data sheet.
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