SLVAEB1A March 2020 – October 2021 TLV62568 , TLV62569 , TLV62585
- Trademarks
- 1Introduction
- 2Describing the TLV62569 Package Technologies: SOT23-5, SOT23-6, and SOT563
- 3Understanding Thermal Performance and Junction Temperature Estimation
- 4Measurement Setup and Test Results
- 5Thermal Performance Analysis for SOT23-5, SOT23-6, and SOT563 Packages
- 6Summary
- 7References
- 8Revision History
4 Measurement Setup and Test Results
This section shows a comparison of the performances of the TLV62569 which has the same die area in the three packages: SOT23-5 (DBV), SOT23-6 (DDC), and SOT563 (DRL).
For analyzing the thermal performance across the three different packages, the efficiency is measured on the three different Evaluation Modules (EVM) shown in Table 4-1. The case temperature is measured with a thermal camera as shown in Figure 4-1 and the junction temperature is estimated using Equation 1 as explained in the previous section.
Figure 4-1 Case Temperature Measurement with a Thermal CameraTable 4-1 EVMs Used for
Measurements
| SOT23-5 PACKAGE (DBV) TLV62569EVM-789 |
SOT23-6 PACKAGE
(DDC) TLV62569EVM-884 |
SOT563 PACKAGE
(DRL) TLV62569EVM-860 |
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