SLVAEF4C august   2019  – may 2023 TPS7H4001-SP

PRODUCTION DATA  

  1.   1
  2.   Single-Event Effects Test Report of the TPS7H4001-SP
  3.   Trademarks
  4. Introduction
  5. Single-Events Effects (SEE)
  6. Test Device and Evaluation Board Information
  7. Irradiation Facility and Setup
  8. Depth, Range, and LETEFF Calculation
  9. Test Setup and Procedures
  10. Destructive Single-Event Effects (DSEE)
    1. 7.1 Safe-Operating-Area (SOA) Results
    2. 7.2 Single Event Latch-Up (SEL) Results
    3. 7.3 Single-Event-Burnout (SEB) and Single-Event-Gate-Rupture (SEGR) Results
  11. Single-Event Transients (SET)
  12. Summary
  13. 10Total Ionizing Dose (TID) From SEE Experiments
  14. 11References
  15. 12Revision History

Test Device and Evaluation Board Information

The TPS7H4001-SP is packaged in a 34-pin thermally-enhanced dual ceramic flat pack package (HKH) as shown in Figure 3-1. The TPS7H4001EVM-CVAL evaluation board was used to evaluate the performance and characteristics of the TPS7H4001-SP under heavy-ions. Board schematics are shown in Figure 3-3. Top view of the evaluation board used for radiation testing campaign is shown in Section 3.

GUID-B6900101-C4FB-4C86-A65A-5753D8DA32C6-low.gif
The package lid was removed to reveal the die face for all heavy-ion testing.
Figure 3-1 Photograph of Delidded TPS7H4001-SP [Left] and a Pin-Out Diagram [Right]
GUID-20211214-SS0I-1TFD-1G1X-RVG43ZG5G5VG-low.jpg Figure 3-2 Photograph of the Delidded TPS7H4001-SP (SHP) [Left] and a Pin-Out Diagram [Right]

During some SET testing runs of the TPS7H4001-SP, the PWRGD filter was populated as indicated on the schematics. It is important to notice that the EVM ships with these components default as DNI. Transistor Q1 was removed for all the SEE test campaign.

GUID-20201109-CA0I-KSZP-7ZDS-CRKWRMBW6JDN-low.gifFigure 3-3 Schematic of the TPS7H4001EVM-CVAL Used During SEE Testing
GUID-20201109-CA0I-VFNN-RPCM-DMVXF5B4SHSG-low.jpg Figure 3-4 TPS7H4001EVM-CVAL Board (Top View)