SLVAF55
July 2021
TPS62130
,
TPS62901
,
TPS62902
,
TPS62903
Trademarks
1
Introduction
2
Power Density
3
Achieving a Smaller Solution
3.1
Smaller Package and Fewer External Components
3.2
Smart Configuration Pin
3.3
VSET
4
Reducing Power Loss
4.1
Junction Temperature
4.2
Automatic Efficiency Enhancement (AEE™)
4.3
1MHz and 2.5MHz Switching Frequencies
4.4
Auto PFM/PWM vs. Forced PWM
5
Application Flexibility
5.1
Quiescent Current
5.2
Lower and More Accurate Output Voltages
5.3
Capacitive Discharge
6
Summary
7
References
7
References
Texas Instruments,
Understanding the Trade-offs and Technologies to Increase Power Density
marketing white paper.
Texas Instruments,
Multi-Function Pins are Easy
application brief.
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