SLVK173 July 2024 TPS7H4011-SP
- 1
- TPS7H4011-SP Single-Event Effects (SEE)
- Trademarks
- 1 Introduction
- 2 Single-Event Effects (SEE)
- 3 Device and Test Board Information
- 4 Irradiation Facility and Setup
- 5 Depth, Range, and LETEFF Calculation
- 6 Test Setup and Procedures
- 7 Destructive Single-Event Effects (DSEE)
- 8 Single-Event Transients (SET)
- 9 Event Rate Calculations
- 10Summary
- A Total Ionizing Dose from SEE Experiments
- B References
6 Test Setup and Procedures
There were two input supplies used to power the TPS7H4011-SP which provided VIN and EN. The VIN for the device was provided through Channel 3 of an N6705C power module and ranged from 5 and 12V for SET to 14V for SEL and SEB/SEGR. EN was powered by Channel 1 of an E36311A power supply and ranged from 0V for SEB Off to 5V for all other testing.
The instrument used to load the TPS7H4011-SP was a Chroma E36300 E-Load that was used in Constant Resistance (CR) mode. The value of CR was 0.2718Ω and provided a 12A load on the device.
The primary signal monitored on the EVM was VOUT and this was done using a Tektronix MSO58B with a 3% window trigger based on the nominal measured value of VOUT. All SEB On, SEL, and SET testing used these conditions with only the SEB Off testing having different conditions. The conditions for SEB Off were a positive edge trigger at 0.5V which would check to see if the device ever incorrectly turned on while it was disabled. The secondary signals monitored were the PWRGD and SS_TR pins. These signals were monitored on PXIe-5172 cards and were configured to have edge triggers. The PG signal had an edge trigger at 500mV below nominal and the SS signal had an edge trigger at 20% below nominal.
All equipment other than the MSO58B was controlled and monitored using a custom-developed LabVIEW™ program (PXI-RadTest) running on a HP-Z4™ desktop computer. The computer communicates with the PXI chassis via an MXI controller and NI PXIe-8381 remote control module. The MSO58B was used using the manufacturer interface. The MSO was set to fast-frame for all SET data collection.
Equipment Settings and Parameters Used During the SEE Testing of the TPS7H4011-SP shows the connections, limits, and compliance values used during the testing. Figure 6-1 shows a block diagram of the setup used for SEE testing of the TPS7H4011-SP.
| Pin Name | Equipment Used | Capability | Compliance | Range of Values Used |
|---|---|---|---|---|
| VIN | N6705C (CH # 3) | 60V, 17A | 5A | 5 to 14V |
| EN | E36311A (CH # 1) | 6V, 5A | 0.1A | 0V, 5V |
| VOUT | MSO58B | 1GS/s | — | 250 GS/s |
| SS_TR | PXIe-5172 (1) | 100MS/s | — | 100MS/s |
| PWRGD | PXIe-5172 (2) | 100MS/s | — | 100MS/s |
| VOUT | Chroma E36300 Load | 80A | High | — |
All boards used for SEE testing were fully checked for functionality. Dry runs were also performed to ensure that the test system was stable under all bias and load conditions prior to being taken to the TAMU facility. During the heavy-ion testing, the LabVIEW control program powered up the TPS7H4011-SP device and set the external sourcing and monitoring functions of the external equipment. After functionality and stability was confirmed, the beam shutter was opened to expose the device to the heavy-ion beam. The shutter remained open until the target fluence was achieved (determined by external detectors and counters). During irradiation, the NI scope cards continuously monitored the signals. When the output exceeded the pre-defined 3% window trigger, a data capture was initiated. No sudden increases in current were observed (outside of normal fluctuations) on any of the test runs and indicated that no SEL or SEB/SEGR events occurred during any of the tests.
Figure 6-1 Block Diagram of the SEE Test
Setup for the TPS7H4011-SP