SLVS840D November   2015  – August 2016

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Typical Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 ON and OFF Control
      2. 8.3.2 Quick Output Discharge (QOD) (TPS22925B and TPS22925C Only)
      3. 8.3.3 Reverse Current Blocking
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 VIN to VOUT Voltage Drop
      2. 9.1.2 Input Capacitor (CIN)
      3. 9.1.3 Load Capacitor (CL)
      4. 9.1.4 Standby Power Reduction
      5. 9.1.5 Power Multiplexing
      6. 9.1.6 Thermal Considerations
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Managing Inrush Current
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

7 Specifications

7.1 Absolute Maximum Ratings

over operating free–air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VIN, ON Input voltage –0.3 4 V
VOUT Output voltage –0.3 4 V
IMAX Maximum continuous switch current at TA = 60°C 3 A
IPLS Maximum pulsed switch current, 100–μs pulse, 2% duty cycle 4 A
TJ Junction temperature 125 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.

7.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human–body model (HBM), per ANSI/ESDA/JEDEC JS–001(1) ±2000 V
Charged–device model (CDM), per JEDEC specification JESD22–C101(2) ±1000
(1) JEDEC document JEP155 states that 500–V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 500–V HBM is possible with the necessary precautions.
(2) JEDEC document JEP157 states that 250–V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 250–V CDM is possible with the necessary precautions.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VIN Input voltage 0.65 3.6 V
VOUT Output voltage 0 3.6 V
VIH High–level input voltage, ON 0.9 3.6 V
VIL Low–level input voltage, ON 0 0.45 V
CIN Input capacitance 1 µF
TA Operating free–air temperature –40 105 °C

7.4 Thermal Information

THERMAL METRIC(1) TPS22925xx UNIT
YPH (DSBGA)
6 PINS
RθJA Junction–to–ambient thermal resistance 110.9 °C/W
RθJC(top) Junction–to–case (top) thermal resistance 1.2 °C/W
RθJB Junction–to–board thermal resistance 30.4 °C/W
ψJT Junction–to–top characterization parameter 0.8 °C/W
ψJB Junction–to–board characterization parameter 30.4 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

7.5 Electrical Characteristics

over operating free–air temperature range (unless otherwise noted). Typical values are for TA = 25°C.
PARAMETER TEST CONDITIONS TA MIN TYP MAX UNIT
IQ,VIN Quiescent current VON = 3.6 V,
IOUT = 0 A		 VIN = 3.6 V –40°C to +85°C 29 71 µA
–40°C to +105°C 84
VIN = 2.5 V –40°C to +85°C 28 67
–40°C to +105°C 79
VIN = 1.8 V –40°C to +85°C 26 65
–40°C to +105°C 76
VIN = 1.2 V –40°C to +85°C 20 55
–40°C to +105°C 66
VIN = 1 V –40°C to +85°C 16 50
–40°C to +105°C 60
VIN = 0.65 V –40°C to +85°C 10 39
–40°C to +105°C 49
ISD,VIN VIN shutdown current VON = 0 V,
VOUT = 0 V		 VIN = 3.6 V –40°C to +85°C 0.5 5 µA
–40°C to +105°C 9
VIN = 2.5 V –40°C to +85°C 0.5 4
–40°C to +105°C 6
VIN = 1.8 V –40°C to +85°C 0.5 4
–40°C to +105°C 6
VIN = 1.2 V –40°C to +85°C 0.5 3
–40°C to +105°C 5
VIN = 1 V –40°C to +85°C 0.5 3
–40°C to +105°C 5
VIN = 0.65 V –40°C to +85°C 0.5 3
–40°C to +105°C 5
ION ON pin input leakage current 0.9 V ≤ VON ≤ 3.6 V –40°C to +105°C 0.1 µA
IRC,VIN Reverse current when disabled VIN = VON = 0 V, VOUT = 3.6 V –40°C to +85°C –0.2 –2.5 µA
–40°C to +105°C –6
RON On-resistance IOUT = –200 mA VIN = 3.6 V 25°C 9.2 13 mΩ
–40°C to +85°C 15
–40°C to +105°C 16
VIN = 2.5 V 25°C 9.2 13
–40°C to +85°C 15
–40°C to +105°C 16
VIN = 1.8 V 25°C 9.2 13
–40°C to +85°C 15
–40°C to +105°C 16
VIN = 1.2 V 25°C 9.5 14
–40°C to +85°C 16
–40°C to +105°C 17
VIN = 1 V 25°C 10.2 15
–40°C to +85°C 17
–40°C to +105°C 18
VIN = 0.65 V 25°C 13.1 20
–40°C to +85°C 23
–40°C to +105°C 25
VHYS ON pin hysteresis VIN = 3.6 V 25°C 86 mV
VIN = 2.5 V 83
VIN = 1.8 V 82
VIN = 1.2 V 80
VIN = 1 V 79
VIN = 0.65 V 79
RPD(1) Output pull-down resistance VIN = VOUT = 3.6 V,
VON = 0 V		 –40°C to +85°C 150 205 Ω
–40°C to +105°C 215
(1) Applies to TPS22925B and TPS22925C only.

7.6 Switching Characteristics(1)

over operating free-air temperature range (unless otherwise noted) VON = 3.6 V, RL = 10 Ω, CIN = 1 µF, CL = 0.1 µF,TA = 25°C
PARAMETER TEST CONDITIONS TYP
(TPS22925Bx)		 TYP
(TPS22925Cx)		 UNIT
tON Turnon time VIN = 3.6 V 110 900 µs
VIN = 1.8 V 94 730
VIN = 0.65 V 86 620
tOFF Turnoff time VIN = 3.6 V 3 3 µs
VIN = 1.8 V 2.7 2.7
VIN = 0.65 V 10.9 10.9
tR Output voltage rise time VIN = 3.6 V 97 810 µs
VIN = 1.8 V 61 520
VIN = 0.65 V 36 300
tF Output voltage fall time VIN = 3.6 V 2.2 2.2 µs
VIN = 1.8 V 2.1 2.1
VIN = 0.65 V 3.6 3.6
tD Delay time VIN = 3.6 V 64 500 µs
VIN = 1.8 V 66 490
VIN = 0.65 V 68 470
(1) Turn-off time and fall time are dependent on the time constant at the load. For TPS22925BN and TPS22925CN, there is no QOD. The time constant is RL× CL. For TPS22925B and TPS22925C, internal pull-down resistor RPD is enabled when the switch is disabled. The time constant is (RPD || RL) × CL.
TPS22925 test_circuit_slvs840.gif Figure 1. Timing Test Circuit
TPS22925 timing_wav_slvs840.gif
Rise times and fall times of the control signal is 100 ns.
Figure 2. Timing Waveforms

7.7 Typical Characteristics

TPS22925 D001_SLVS840.gif
VON = 3.6 V IOUT = 0 A
Figure 3. Quiescent Current vs Input Voltage
TPS22925 D003_SLVS840.gif
VON = 3.6 V IOUT = –200 mA
Figure 5. On-Resistance vs Temperature
TPS22925 D005_SLVS840.gif
VON = 3.6 V IOUT = –200 mA
Figure 7. On-Resistance vs Input Voltage
TPS22925 D007_SLVS840.gif
VON = 0 V VOUT = VIN
Figure 9. Output Pull-Down Resistance vs Input Voltage
TPS22925 D009_SLVS840.gif
IOUT = 0 A
Figure 11. High-Level Input Voltage vs Input Voltage
TPS22925 D011_SLVS840.gif
VON rising from 0 V to 3.6 V CIN = 1 μF
CL = 0.1 μF RL = 10 Ω
Figure 13. Turn-on Time vs Input Voltage (TPS22925Bx)
TPS22925 D013_SLVS840.gif
VON falling from 3.6 V to 0 V CIN = 1 μF
CL = 0.1 μF RL = 10 Ω
Figure 15. Turn-Off Time vs Input Voltage
TPS22925 D015_SLVS840.gif
VON rising from 0 V to 3.6 V CIN = 1 μF
CL = 0.1 μF RL = 10 Ω
Figure 17. Rise Time vs Input Voltage (TPS22925Cx)
TPS22925 D017_SLVS840.gif
VON rising from 0 V to 3.6 V CIN = 1 μF
CL = 0.1 μF RL = 10 Ω
Figure 19. Delay Time vs Input Voltage (TPS22925Bx)
TPS22925 D002_SLVS840.gif
VON = 0 V VOUT = 0 V
Figure 4. Input Shutdown Current vs Input Voltage
TPS22925 D004_SLVS840.gif
VON = 3.6 V TA = 25°C
Figure 6. On-Resistance vs Output Current
TPS22925 D006_SLVS840.gif
VON = 3.6 V IOUT = –3 A
Figure 8. On-Resistance vs Input Voltage
TPS22925 D008_SLVS840.gif
IOUT = 0 A
Figure 10. Hysteresis vs Input Voltage
TPS22925 D010_SLVS840.gif
IOUT = 0 A
Figure 12. Low-Level Input Voltage vs Input Voltage
TPS22925 D012_SLVS840.gif
VON rising from 0 V to 3.6 V CIN = 1 μF
CL = 0.1 μF RL = 10 Ω
Figure 14. Turn-On Time vs Input Voltage (TPS22925Cx)
TPS22925 D014_SLVS840.gif
VON rising from 0 V to 3.6 V CIN = 1 μF
CL = 0.1 μF RL = 10 Ω
Figure 16. Rise Time vs Input Voltage (TPS22925Bx)
TPS22925 D016_SLVS840.gif
VON falling from 3.6 V to 0 V CIN = 1 μF
CL = 0.1 μF RL = 10 Ω
Figure 18. Fall Time vs Input Voltage
TPS22925 D018_SLVS840.gif
VON rising from 0 V to 3.6 V CIN = 1 μF
CL = 0.1 μF RL = 10 Ω
Figure 20. Delay Time vs Input Voltage (TPS22925Cx)

7.8 Typical Characteristics

CIN = 1 μF, CL = 0.1 μF, RL = 10 Ω, TA = 25°C
TPS22925 TPS22925B_36_36_on_fig21.png
VIN = 3.6 V
Figure 21. Turnon Response (TPS22925Bx)
TPS22925 TPS22925B_65_36_on_fig23.png
VIN = 0.65 V
Figure 23. Turnon Response (TPS22925Bx)
TPS22925 TPS22925C_18_36_on_fig25.png
VIN = 1.8 V
Figure 25. Turnon Response (TPS22925Cx)
TPS22925 TPS22925C_36_36_off_fig27.png
VIN = 3.6 V
Figure 27. Turnoff Response (TPS22925xx)
TPS22925 TPS22925C_65_36_off_fig29.png
VIN = 0.65 V
Figure 29. Turnoff Response (TPS22925xx)
TPS22925 TPS22925B_18_36_on_fig22.png
VIN = 1.8 V
Figure 22. Turnon Response (TPS22925Bx)
TPS22925 TPS22925C_36_36_on_fig24.png
VIN = 3.6 V
Figure 24. Turnon Response (TPS22925Cx)
TPS22925 TPS22925C_65_36_on_fig26b.png
VIN = 0.65 V
Figure 26. Turnon Response (TPS22925Cx)
TPS22925 TPS22925C_18_36_off_fig28.png
VIN =1.8 V
Figure 28. Turnoff Response (TPS22925xx)
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