SLVSAG8G September 2011 – June 2016 TPS612592
UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA.
- 1 Features
- 2 Applications
- 3 Description
- 4 Revision History
- 5 Device Options
- 6 Pin Configuration and Functions
- 7 Specifications
- 8 Parameter Measurement Information
- 9 Detailed Description
- 10Application and Implementation
- 11Power Supply Recommendations
- 12Layout
- 13Device and Documentation Support
- 14Mechanical, Packaging, and Orderable Information
14 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
14.1 Package Summary
Chip Scale Package
(Bottom View)
Chip Scale Package
(Top View)
Code:
- YM - 2 digit date code
- S - assembly site code
- CC - chip code (see ordering table)
- LLLL - lot trace code
14.1.1 Package Dimensions
The dimensions for the YFF-9 package are shown in Table 6. See the package drawing at the end of this data sheet.
Table 6. YFF-9 Package Dimensions
| PACKAGED DEVICES | D | E |
|---|---|---|
| TPS6125xYFF | max = 1.236mm; min = 1.176 mm | max = 1.336 mm, min = 1.276 mm |
