SLVSAW2C March   2012  – October 2016

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Enable and Disable (EN)
      2. 8.3.2  Softstart (SS) and Hiccup Current Limit During Startup
      3. 8.3.3  Voltage Tracking (SS)
      4. 8.3.4  Short Circuit Protection (Hiccup-Mode)
      5. 8.3.5  Output Discharge Function
      6. 8.3.6  Power Good Output (PG)
      7. 8.3.7  Frequency Set Pin (FREQ)
      8. 8.3.8  Undervoltage Lockout (UVLO)
      9. 8.3.9  Thermal Shutdown
      10. 8.3.10 Charge Pump (CP, CN)
    4. 8.4 Device Functional Modes
      1. 8.4.1 Pulse Width Modulation Operation
      2. 8.4.2 Power Save Mode Operation
      3. 8.4.3 Low Dropout Operation (100% Duty Cycle)
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Inductor Selection
        2. 9.2.2.2 Input and Output Capacitor Selection
        3. 9.2.2.3 Setting the Output Voltage
        4. 9.2.2.4 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guideline
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Related Links
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

4 Revision History

Changes from B Revision (April 2014) to C Revision

  • Changed Feature bullet text From "Two Level...." To "Hiccup..."; and, deleted "Wide Output Capacitance Selection" bulletGo
  • Added CN and CP pin absolute maximum ratingsGo
  • Moved Storage Temp spec to the "Absolute Maximum Ratings" table Go
  • Added Feedback voltage accuracy at TJ = 25°CGo
  • Changed Legend in Figure 2 and Figure 4 to show correct voltages Go
  • Updated Voltage Tracking (SS) sectionGo
  • Added Charge Pump (CP, CN) section Go
  • Updated PCB layout exampleGo
  • Added Community Resources sectionGo

Changes from A Revision (March 2012) to B Revision

  • Changed the data sheet to meet the new TI standard Format Go
  • Changed the Typical Characteristics. Moved graphs to the Application and Implementation sectionGo
  • Added the Layout section Go

Changes from * Revision (March 2012) to A Revision

  • Changed the FUNCTIONAL BLOCK DIAGRAMGo
  • Changed R1 and R2 values in Figure 9Go
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