SLVSBD0B November   2012  – June 2020

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Typical Application as USB Power Switch
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Overcurrent Conditions
      2. 8.3.2 Reverse-Voltage Protection
      3. 8.3.3 FAULT Response
      4. 8.3.4 Undervoltage Lockout (UVLO)
      5. 8.3.5 Enable (EN)
      6. 8.3.6 Thermal Sense
    4. 8.4 Device Functional Modes
    5. 8.5 Programming
      1. 8.5.1 Programming the Current-Limit Threshold
  9. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Constant-Current and Impact on Output Voltage
      2. 9.1.2 Accounting for Resistor Tolerance
      3. 9.1.3 Input and Output Capacitance
    2. 9.2 Typical Applications
      1. 9.2.1 Application 1: Designing Above a Minimum Current-Limit
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Application 2: Designing Below a Maximum Current-Limit
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
      3. 9.2.3 Application 3: Auto-Retry Functionality
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
      4. 9.2.4 Application 4: Two-Level Current-Limit Circuit
        1. 9.2.4.1 Design Requirements
        2. 9.2.4.2 Detailed Design Procedure
      5. 9.2.5 Application 5: Typical Application as USB Power Switch
        1. 9.2.5.1 Design Requirements
        2. 9.2.5.2 Detailed Design Procedure
          1. 9.2.5.2.1 Universal Serial Bus (USB) Power-Distribution Requirements
  10. 10Power Supply Recommendations
    1. 10.1 USB Self-Powered (SPH) and Bus-Powered (BPH) Hubs
    2. 10.2 USB Low-Power Bus-Powered and High-Power Bus-Powered Functions
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Power Dissipation and Junction Temperature
  12. 12Device and Documentation Support
    1. 12.1 Device Support
    2. 12.2 Support Resource
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Thermal Information

THERMAL METRIC(1) TPS2553-Q1 UNIT
DBV (SOT-23)
6 PINS
RθJA Junction-to-ambient thermal resistance 182.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 122.2 °C/W
RθJB Junction-to-board thermal resistance 29.4 °C/W
ψJT Junction-to-top characterization parameter 20.8 °C/W
ψJB Junction-to-board characterization parameter 28.9 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a °C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.