SLVSC16B August 2013 – July 2016
PRODUCTION DATA.
- 1 Features
- 2 Applications
- 3 Description
- 4 Revision History
- 5 Pin Configuration and Functions
- 6 Specifications
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7 Detailed Description
- 7.1 Overview
- 7.2 Functional Block Diagram
- 7.3 Feature Description
- 7.4
Device Functional Modes
- 7.4.1
Buck Controllers: Normal Mode PWM Operation
- 7.4.1.1 Frequency Selection and External Synchronization
- 7.4.1.2 Enable Inputs
- 7.4.1.3 Feedback Inputs
- 7.4.1.4 Soft-Start Inputs
- 7.4.1.5 Current-Mode Operation
- 7.4.1.6 Current Sensing and Current Limit With Foldback
- 7.4.1.7 Slope Compensation
- 7.4.1.8 Power-Good Outputs and Filter Delays
- 7.4.1.9 Light-Load PFM Mode
- 7.4.1
Buck Controllers: Normal Mode PWM Operation
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8 Application and Implementation
- 8.1 Application Information
- 8.2
Typical Application
- 8.2.1 Design Requirements
- 8.2.2
Detailed Design Procedure
- 8.2.2.1 Boost Component Selection
- 8.2.2.2 Boost Maximum Input Current IIN_MAX
- 8.2.2.3 Boost Inductor Selection, L
- 8.2.2.4 Inductor Ripple Current, IRIPPLE
- 8.2.2.5 Peak Current in Low-Side FET, IPEAK
- 8.2.2.6 Right Half-Plane Zero RHP Frequency, fRHP
- 8.2.2.7 Output Capacitor, COUTx
- 8.2.2.8 Bandwidth of Boost Converter, fC
- 8.2.2.9 Output Ripple Voltage Due to Load Transients, ∆VOUTx
- 8.2.2.10 Selection of Components for Type II Compensation
- 8.2.2.11 Input Capacitor, CIN
- 8.2.2.12 Output Schottky Diode D1 Selection
- 8.2.2.13 Low-Side MOSFET (BOT_SW3)
- 8.2.2.14 BuckA Component Selection
- 8.2.2.15 Inductor Selection L
- 8.2.2.16 Inductor Ripple Current IRIPPLE
- 8.2.2.17 Output Capacitor COUTA
- 8.2.2.18 Bandwidth of Buck Converter fC
- 8.2.2.19 Selection of Components for Type II Compensation
- 8.2.2.20 Resistor Divider Selection for Setting VOUTA Voltage
- 8.2.2.21 BuckB Component Selection
- 8.2.2.22 Resistor Divider Selection for Setting VOUT Voltage
- 8.2.2.23 BuckX High-Side and Low-Side N-Channel MOSFETs
- 8.2.3 Application Curves
- 8.3 System Examples
- 9 Power Supply Recommendations
- 10Layout
- 11Device and Documentation Support
- 12Mechanical, Packaging, and Orderable Information
11 Device and Documentation Support
11.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.
11.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.
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TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
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Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.
11.3 Trademarks
PowerPAD, E2E are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
11.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
11.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.