SLVSDV6C November   2017  – November 2019

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application Schematic space space space space
      2.      Efficiency vs Output Current space
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Enable / Shutdown and Output Discharge
      2. 8.3.2 Soft-Start
      3. 8.3.3 Power Good (PG)
      4. 8.3.4 Undervoltage Lockout (UVLO)
      5. 8.3.5 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Pulse Width Modulation (PWM) Operation
      2. 8.4.2 Power Save Mode (PSM) Operation
      3. 8.4.3 Minimum Duty Cycle and 100% Mode Operation
      4. 8.4.4 Current Limit and Short Circuit Protection
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Custom Design With WEBENCH® Tools
        2. 9.2.2.2 Setting the Adjustable Output Voltage
        3. 9.2.2.3 Feed-forward Capacitor Selection
        4. 9.2.2.4 Output Filter Selection
        5. 9.2.2.5 Inductor Selection
        6. 9.2.2.6 Output Capacitor Selection
        7. 9.2.2.7 Input Capacitor Selection
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Related Links
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

9.2.1 Design Requirements

The following design guideline provides a range for the component selection to operate within the recommended operating conditions. Table 2 shows the components selection that was used for the measurements shown in the Application Curves.

Table 2. List of Components

REFERENCE DESCRIPTION MANUFACTURER
IC 5.5-V, step-down converter TPS6282xDLC, Texas Instruments
L1 470 nH ±20%, 7.6mΩ DCR, 6.6A ISAT XFL4015-471MEB, Coilcraft
C1 4.7 µF ±20%, 6.3V, ceramic, 0603, X7R JMK107BB7475MA-T, Taiyo Yuden
C2, C3 10 µF ±20%, 10V, ceramic, 0603, X7R GRM188Z71A106MA73D, MuRata
Cff 120pF ±5%, 50V, 0603 GRM1885C1H121JA01D, MuRata
R1, R2 Depending on VOUT, chip, 0603 Standard
R3 100-kΩ, chip, 0603, 0.1W, 1% Standard
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