SLVUC93
September 2021
TPSM63606
Trademarks
1
High-Density EVM Description
1.1
Typical Applications
1.2
Features and Electrical Performance
2
EVM Performance Specifications
3
EVM Photo
4
Test Setup and Procedure
4.1
EVM Connections
4.2
EVM Setup
4.3
Test Equipment
4.4
Recommended Test Setup
4.4.1
Input Connections
4.4.2
Output Connections
4.5
Test Procedure
4.5.1
Line/Load Regulation and Efficiency
5
Test Data and Performance Curves
5.1
Efficiency and Load Regulation Performance
5.2
Waveforms
5.3
Bode Plot
5.4
Thermal Performance
5.5
EMI Performance
6
EVM Documentation
6.1
Schematic
6.2
Bill of Materials
6.3
PCB Layout
6.4
Assembly Drawings
6.5
Multi-Layer Stackup
7
Device and Documentation Support
7.1
Device Support
7.1.1
Development Support
7.1.1.1
Custom Design With WEBENCH® Tools
7.2
Documentation Support
7.2.1
Related Documentation
7.2.1
Related Documentation
For related documentation, see the following:
Innovative DC/DC Power Modules
selection guide
Enabling Small, Cool and Quiet Power Modules with Enhanced HotRod™ QFN Package Technology
white paper
Benefits and Trade-offs of Various Power-Module Package Options
white paper
Simplify Low EMI Design with Power Modules
white paper
Power Modules for Lab Instrumentation
white paper
An Engineer's Guide To EMI In DC/DC Regulators
e-book
Soldering Considerations for Power Modules
application report
Practical Thermal Design With DC/DC Power Modules
application report
Using New Thermal Metrics
application report
AN-2020 Thermal Design By Insight, Not Hindsight
application report
Using the TPSM53602/3/4 for Negative Output Inverting Buck-Boost Applications
application report
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