SLVUCF1A September   2022  – October 2022 TPSM63610

 

  1.   Abstract
  2.   Trademarks
  3. 1High-Density EVM Description
    1. 1.1 Typical Applications
  4. 2Test Setup and Procedure
    1. 2.1 EVM Connections
    2. 2.2 EVM Setup
    3. 2.3 Test Equipment
    4. 2.4 Recommended Test Setup
      1. 2.4.1 Input Connections
      2. 2.4.2 Output Connections
    5. 2.5 Test Procedure
      1. 2.5.1 Line, Load Regulation and Efficiency
  5. 3Test Data and Performance Curves
    1. 3.1 Efficiency and Load Regulation Performance
    2. 3.2 Waveforms
    3. 3.3 Bode Plot
    4. 3.4 EMI Performance
  6. 4EVM Documentation
    1. 4.1 Schematic
    2. 4.2 Bill of Materials
    3. 4.3 PCB Layout
    4. 4.4 Multi-Layer Stackup
  7. 5Device and Documentation Support
    1. 5.1 Device Support
      1. 5.1.1 Development Support
        1. 5.1.1.1 Custom Design With WEBENCH® Tools
    2. 5.2 Documentation Support
      1. 5.2.1 Related Documentation
  8. 6Revision History

4.3 PCB Layout

Figure 4-2 through Figure 4-7 show the PCB layout images, including 3D views, copper layers, assembly drawings, and layer stackup diagram. The PCB is 62-mils standard thickness with 2-oz copper on all layers.

Figure 4-2 3D Top View
Figure 4-3 3D Bottom View
Figure 4-4 Top Layer Copper
Figure 4-5 Layer 2 Copper
Figure 4-6 Layer 3 Copper
Figure 4-7 Bottom Layer Copper (Viewed From Top)
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