SLVUCF1A September   2022  – October 2022 TPSM63610

 

  1.   Abstract
  2.   Trademarks
  3. 1High-Density EVM Description
    1. 1.1 Typical Applications
  4. 2Test Setup and Procedure
    1. 2.1 EVM Connections
    2. 2.2 EVM Setup
    3. 2.3 Test Equipment
    4. 2.4 Recommended Test Setup
      1. 2.4.1 Input Connections
      2. 2.4.2 Output Connections
    5. 2.5 Test Procedure
      1. 2.5.1 Line, Load Regulation and Efficiency
  5. 3Test Data and Performance Curves
    1. 3.1 Efficiency and Load Regulation Performance
    2. 3.2 Waveforms
    3. 3.3 Bode Plot
    4. 3.4 EMI Performance
  6. 4EVM Documentation
    1. 4.1 Schematic
    2. 4.2 Bill of Materials
    3. 4.3 PCB Layout
    4. 4.4 Multi-Layer Stackup
  7. 5Device and Documentation Support
    1. 5.1 Device Support
      1. 5.1.1 Development Support
        1. 5.1.1.1 Custom Design With WEBENCH® Tools
    2. 5.2 Documentation Support
      1. 5.2.1 Related Documentation
  8. 6Revision History

3.4 EMI Performance

See the Schematic and Bill of Materials for details of the input EMI filter to pass CISPR 11/32 Class B conducted emissions.

Default EVM VOUT = 5 V FSW = 1 MHz
Figure 3-19 CISPR 11/32 Class B Conducted Emissions: VIN = 24 V, SPSP ON
Additional 2 × 10 pF CIN with EMI filter removed VOUT = 5 V FSW = 1 MHz
Figure 3-20 CISPR 11 Class B Radiated Emissions: VIN = 24 V, SPSP ON
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