SLVUCF1A
September 2022 – October 2022
TPSM63610
Abstract
Trademarks
1
High-Density EVM Description
1.1
Typical Applications
2
Test Setup and Procedure
2.1
EVM Connections
2.2
EVM Setup
2.3
Test Equipment
2.4
Recommended Test Setup
2.4.1
Input Connections
2.4.2
Output Connections
2.5
Test Procedure
2.5.1
Line, Load Regulation and Efficiency
3
Test Data and Performance Curves
3.1
Efficiency and Load Regulation Performance
3.2
Waveforms
3.3
Bode Plot
3.4
EMI Performance
4
EVM Documentation
4.1
Schematic
4.2
Bill of Materials
4.3
PCB Layout
4.4
Multi-Layer Stackup
5
Device and Documentation Support
5.1
Device Support
5.1.1
Development Support
5.1.1.1
Custom Design With WEBENCH® Tools
5.2
Documentation Support
5.2.1
Related Documentation
6
Revision History
4.4
Multi-Layer Stackup
Figure 4-8
Layer Stackup
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