SLVUCY4A
June 2024 – November 2024
LM5190-Q1
1
Description
Features
Applications
5
1
Evaluation Module Overview
1.1
Introduction
1.2
Kit Contents
1.3
Specification
1.4
Device Information
2
Hardware
2.1
Test Setup and Procedure
2.1.1
EVM Connections
2.1.2
Test Equipment
2.1.3
Recommended Test Setup
2.1.3.1
Input Connections
2.1.3.2
Output Connections
2.1.4
Test Procedure
2.1.4.1
Basic Test Procedure
3
Implementation Results
3.1
Test Data and Performance Curves
3.1.1
Efficiency
3.1.2
Operating Waveforms
3.1.2.1
Start-Up and Shutdown With EN
3.1.2.2
Switching
3.1.2.3
Load Transient (CV), ISET Modulation (CC)
3.1.3
Thermal Performance
3.1.4
Bode Plot
3.1.5
EMI Performance
4
Hardware Design Files
4.1
Schematic
4.2
PCB Layout
4.3
Bill of Materials
5
Additional Information
5.1
Trademarks
6
Device and Documentation Support
6.1
Device Support
6.1.1
Development Support
6.2
Documentation Support
6.2.1
Related Documentation
6.2.1.1
PCB Layout Resources
6.2.1.2
Thermal Design Resources
7
Revision History
6.2.1.2
Thermal Design Resources
AN-2020 Thermal Design by Insight, Not Hindsight Application Report
AN-1520 A Guide to Board Layout for Best Thermal Resistance for Exposed Pad Packages Application Report
Semiconductor and IC Package Thermal Metrics Application Report
Thermal Design Made Simple with LM43603 and LM43602 Application Report
PowerPAD™
Thermally Enhanced Package Application Report
PowerPAD™
Made Easy Application Brief
Using New Thermal Metrics Application Report
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