SNLA426 june   2023 DS320PR1601 , DS320PR410

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1 Introduction
  5. 2 PCIe Gen3, Gen4, and Gen5 Loss Budget
  6. 3 Minimum Eye Width
  7. 4 Cross Talk Mitigation
  8. 5 Humidity and Temperature Insertion Loss
  9. 6 Critical Signals
  10. 7 General High-Speed Signal Routing
  11. 8 PCB Grain and Fiber Weave Selection
  12. 9 PCB Material Loss Budget
  13. 10High-Speed Signal Trace Impedance
  14. 11High-Speed Signal Trace Length Matching
  15. 12Differential Trace Routing Guidelines
  16. 13Differential-Inter-Pair Matching
  17. 14Intra-pair Length Matching
  18. 15Trace Bends
  19. 16Minimum Differential Trace-To-Trace Distance
  20. 17Serpentine Guidelines
  21. 18High-Speed Differential Signal Quick Rules
  22. 19High-Speed Differential Pair Reference Plane
  23. 20Via Staggering
  24. 21Via Stubs
  25. 22Via Pads
  26. 23Via Discontinuity Mitigation
  27. 24Back-Drill Stubs
  28. 25AC Coupling Capacitors Placement
  29. 26AC Coupling Capacitor Physical Placement
  30. 27Auxiliary Signal AC Match Termination
  31. 28Suggested PCB Stack-ups
  32. 29Summary
  33. 30References

21 Via Stubs

Proper care must be taken when considering high-speed signal trace and via placement on a PCB. TI recommends high-speed traces be placed on the top or bottom layer only. If vias are required, consider back drilling otherwise stub length can result in a reduction of the signal bandwidth.
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