米6体育平台手机版

SNVS820B APRIL 2013 – December 2016

PRODUCTION DATA.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)⁽¹⁾

	MIN	MAX	UNIT
V (V_DD, V_EN/VCC, R, G, B, W)	−0.3	6	V
Voltage on pins	−0.3	V_DD + 0.3 with 6 V maximum	V
Continuous power dissipation⁽²⁾	Internally limited
Junction temperature, T_J-MAX		125	°C
Maximum lead temperature (soldering)	See⁽³⁾
Storage temperature, T_stg	−65	150	°C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at T_J = 150°C (typical) and disengages at T_J = 130°C (typical).

(3) For detailed soldering specifications and information, refer to Texas Instruments Application Note AN-1112 : DSBGA Wafer Level Chip Scale Package.

6.2 ESD Ratings

			VALUE	UNIT
V_(ESD)	Electrostatic discharge	Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾	±1000	V
V_(ESD)	Electrostatic discharge	Charged-device model (CDM), per JEDEC specification JESD22-C101⁽²⁾	±250	V

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

	MIN	MAX	UNIT
V_DD	2.7	5.5	V
V_EN/VCC	1.65	V_DD	V
Junction temperature, T_J	−40	125	°C
Ambient temperature, T_A⁽¹⁾	−40	85	°C

(1) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (T_A-MAX) is dependent on the maximum operating junction temperature
(T_J-MAX-OP= 125°C), the maximum power dissipation of the device in the application (P_D-MAX), and the junction-to ambient thermal resistance of the part/package in the application (R_θJA), as given by the equation: T_A-MAX = T_J-MAX-OP – (R_θJA × P_D-MAX).

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		LP5562	UNIT
		YQE (DSBGA)
		12 PINS
R_θJA	Junction-to-ambient thermal resistance	85.9	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	1.0	°C/W
R_θJB	Junction-to-board thermal resistance	15.3	°C/W
ψ_JT	Junction-to-top characterization parameter	0.6	°C/W
ψ_JB	Junction-to-board characterization parameter	15.4	°C/W

(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.

6.5 Electrical Characteristics

Unless otherwise specified: limits for typical values are for T_A = 25°C and minimum and maximum limits apply over the operating ambient temperature range (−40°C < T_A < +85°C); V_IN = 3.6V, V_EN/VCC = 1.8 V.⁽¹⁾⁽²⁾⁽³⁾

PARAMETER		TEST CONDITIONS	MIN	TYP	MAX	UNIT
CURRENT CONSUMPTION AND OSCILLATOR ELECTRICAL CHARACTERISTICS
I_VDD	Standby supply current	EN = 0 (pin), CHIP_EN = 0 (bit), external 32 kHz clock running or not running		0.2	2	µA
		EN = 1 (pin), CHIP_EN = 0 (bit), external 32 kHz clock not running		2		µA
		EN = 1 (pin), CHIP_EN = 0 (bit) External 32-kHz clock running		2.4		µA
	Normal mode supply current	LED drivers disabled		0.25		mA
	Normal mode supply current	LED drivers enabled		1		mA
	Powersave mode supply current	External 32-kHz clock running		10		µA
	Powersave mode supply current	Internal oscillator running		0.25		mA
ƒ_OSC	Internal oscillator frequency accuracy	T_A = 25°C	–4%		4%
ƒ_OSC	Internal oscillator frequency accuracy		–7%		7%
LED DRIVER ELECTRICAL CHARACTERISTICS (R, G, B, W OUTPUTS)
I_LEAKAGE	R, G, B, W pin leakage current	T_A = 25°C		0.1	1	µA
I_MAX	Maximum source current	Outputs R, G, B, W		25.5		mA
I_OUT	Accuracy of output current⁽⁴⁾	Output current set to 17.5 mA, V_DD = 3.6 V T_A = 25°C	–4%		4%
I_OUT	Accuracy of output current⁽⁴⁾	Output current set to 17.5 mA, V_DD = 3.6 V	–5%		5%
I_MATCH	Matching⁽⁴⁾	Output current set to 17.5 mA, V_DD = 3.6V		1%	2%
ƒ_LED	LED PWM switching frequency	PWM_HF = 1		558		Hz
ƒ_LED	LED PWM switching frequency	PWM_HF = 0		256		Hz
V_SAT	Saturation voltage⁽⁵⁾	Output current set to 17.5 mA T_A = 25°C		60	100	mV

(1) The electrical characteristics tables list ensured specifications under the listed recommended conditions except as otherwise modified or specified by the electrical characteristics test conditions and/or notes. Typical specifications are estimations only and are not verified by production testing.

(2) All voltages are with respect to the potential at the GND pins.

(3) Minimum and maximum limits are ensured by design, test, or statistical analysis. Typical numbers are not verified by production, but do represent the most likely norm.

(4) Output current accuracy is the difference between the actual value of the output current and programmed value of this current. Matching is the maximum difference from the average. For the constant current outputs on the part, the following are determined: the maximum output current (MAX), the minimum output current (MIN), and the average output current of all outputs (AVG). Two matching numbers are calculated: (MAX – AVG)/AVG and (AVG – MIN)/AVG. The largest number of the two (worst case) is considered the matching figure. Note that some manufacturers have different definitions in use.

(5) Saturation voltage is defined as the voltage when the LED current has dropped 10% from the set value.

6.6 Logic Interface Characteristics

Unless otherwise specified: limits for typical values are for T_A = 25°C and minimum and maximum limits apply over the operating ambient temperature range (−40°C < T_A < +85°C); V_EN = 1.65 V.

PARAMETER		TEST CONDITIONS	MIN	TYP	MAX	UNIT
LOGIC INPUT EN
V_IL	Input low level				0.5	V
V_IH	Input high level		1.2			V
I_I	Logic input current		–1		1	µA
t_DELAY	Input delay⁽¹⁾			2		µs
LOGIC INPUT SCL, SDA, CLK_32K, ADDR_SEL0, ADDR_SEL1, V_EN = 1.8 V
V_IL	Input low level				0.2 × V_EN	V
V_IH	Input high level		0.8 × V_EN			V
I_I	Input current		–1		1	µA
ƒ_{CLK_32K}	Clock frequency			32		kHz
ƒ_SCL	Clock frequency				400	kHz
LOGIC OUTPUT SDA
V_OL	Output low level	I_OUT = 3 mA (pullup current)		0.3	0.5	V
I_L	Output leakage current				1	µA

(1) The I²C host should allow at least 1ms before sending data to the LP5562 after the rising edge of the enable line.

6.7 Recommended External Clock Source Conditions

over operating free-air temperature range (unless otherwise noted)⁽¹⁾⁽²⁾

PARAMETER		TEST CONDITIONS	MIN	TYP	MAX	UNIT
LOGIC INPUT CLK_32K
ƒ_{CLK_32K}	Clock frequency			32.7		kHz
t_CLKH	High time		6			µs
t_CLKL	Low time		6			µs
t_r	Clock rise time	10% to 90%			2	µs
t_f	Clock fall time	90% to 10%			2	µs

(1) Specification is ensured by design and is not tested in production. V_EN = 1.65 V to V_DD.

(2) The ideal external clock signal for the LP5562 is a 0 V to V_EN 25% to 75% duty-cycle square wave. At frequencies above 32.7 kHz, program execution will be faster and at frequencies below 32.7 kHz program execution will be slower.

6.8 I²C Timing Requirements (SDA, SCL)

See⁽¹⁾

		MIN	MAX	UNIT
ƒ_SCL	Clock frequency		400	kHz
1	Hold time (repeated) START condition	0.6		µs
2	Clock low time	1.3		µs
3	Clock high time	600		ns
4	Setup time for a repeated START condition	600		ns
5	Data hold time	50		ns
6	Data setup time	100		ns
7	Rise time of SDA and SCL	20 + 0.1Cb	300	ns
8	Fall time of SDA and SCL	15 + 0.1Cb	300	ns
9	Set-up time for STOP condition	600		ns
10	Bus-free time between a STOP and a START condition	1.3		µs
Cb	Capacitive load for each bus line	10	200	pF

(1) Specification is ensured by design and is not tested in production. V_EN = 1.65 V to V_DD.

Figure 1. External Clock Timing

Figure 2. I²C Timing Parameters

6.9 Typical Characteristics: Current Consumption

Unless otherwise specified: V_DD = 3.6 V, V_EN = 3.3 V. Here are presented input current consumption measurements. Current consumption is measured during a LED blink program execution. Program code sets every LED output to full PWM value for 2 seconds and then PWM is set to 0 for 2 seconds. This is looped endlessly. 750 measurements are taken during one measurement cycle.

Figure 3. Input Current Consumption in Normal Mode With External Clock Running. 4 LEDs (RGBW) Set as Load. Every LED Driver Current Value Is Set to 10 mA.

Figure 5. Input Current Consumption in Power Save Mode With External Clock Running, no LEDs as Load. All 4 LED Drivers are Enabled During Program Execution.

Figure 7. Input Current Consumption in Power Save Mode With External Clock Running, no LEDs as Load. Only 1 LED Driver is Enabled During Program Execution.

Figure 9. Input Current Consumption in Power Save Mode With External Clock Running, no LEDs as Load and no LED Drivers are Enabled During Program Execution.

Figure 4. Input Current Consumption in Normal Mode With Internal Clock Running. 4 LEDs (RGBW) set as Load. Every LED Driver Current Value is Set to 10 mA .

Figure 6. Input Current Consumption in Power Save Mode With Internal Clock Running, no LEDs as Load. All 4 LED Drivers are Enabled During Program Execution.

Figure 8. Input Current Consumption in Power Save Mode With Internal Clock Running, no LEDs as Load. Only 1 LED Driver is Enabled During Program Execution.